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White light LED chip making method

A technology of LED chips and LED epitaxial wafers, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low packaging efficiency of white light LEDs, and achieve the effect of improving packaging production efficiency, high efficiency, and increasing yield

Inactive Publication Date: 2008-08-13
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Description
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AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned problem of low packaging efficiency of white light LEDs, the present invention aims to propose a method for preparing white light LED chips

Method used

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] A typical white LED packaging process is shown in Figure 1, step a: first mix phosphor and resin, step b: stir evenly for degassing, step c: fill into the syringe, step d: fix the LED chip crystal on the metal lead In the bracket cup of the foot bracket, step e: put metal wires on the LED chip crystal and metal pins, step f: the obtained mixture of phosphor powder and resin is coated on the surface of the LED chip through a syringe, step g: resin Encapsulation: The efficiency of the above-mentioned traditional method of coating phosphor is low, and only a single chip can be coated, and the thickness of the post-coated phosphor is uneven, and the thickness of the chip surface is often large, while the thickness of the edge is small , This uneven coating causes uneven color and color temperature of the LED, and often affects the final light effect ...

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Abstract

The present invention provides a method for manufacturing a white light LED chip, the resolvent which is mixed and uniformly blended by the fluorescent powder and adhering dissolvent is loaded into the container of the spraying system, the epitaxial slice after LED chip routine technique firstly is not executed with scribing, the solder pad of the LED chip is covered with photo resist; the LED epitaxial slice before scribing is placed on the table-board of the sample and is covered with the mantle, the nozzle is arranged in the mantle cavity, the spraying system pressurizes to inject the mixed resolvent through the nozzle on the pipeline, and the mixed resolvent is uniformly coated on the surface of the LED epitaxial slice; after the drying of the fluorescent powder adhered on the chip the LED epitaxial slice is executed with photo resist removing technique, the photo resist and fluorescent powder on the solder pad simultaneously break off, and the solder pad is exposed; the LED epitaxial slice is executed with scribing technique so as to divide the chip particle and each independent chip is obtained. The painting technique of the fluorescent powder is added into the LED upriver production, the obtained chip is directly white light LED chip and the packaging efficiency of the downriver white light LED light emitting diode is greatly increased.

Description

technical field [0001] The invention relates to the preparation of a light-emitting diode chip for photoelectric lighting, in particular to a preparation method of a white LED chip which can greatly improve the phosphor coating efficiency of the LED chip, and has controllable coating thickness and high coating uniformity. Background technique [0002] At present, the main technical ways for LEDs to form white light are: ①The most commonly used technical way to form white light is the method of GaN-based blue LEDs using phosphor powder conversion. Blue light with a peak value of about 460nm is emitted, and some blue light-excited phosphors emit yellow-green light with a peak value of about 570nm, and the other part of the transmitted blue light is focused through a micro-lens to form white light; most of the currently used phosphors are aluminates activated by rare earths (YAG), a variety of near-white light can be obtained through the adjustment of phosphors; ② There is anot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 黄生荣吴文鋉
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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