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Technique for processing and recovering disuse acidic copper etchant by metal aluminum

A technology of copper etching and metal aluminum, which is applied in metallurgical wastewater treatment, reduced water/sewage treatment, etc., can solve the negative effects of reaction speed and reaction degree, etc., and achieve the effect of easy removal, easy on-site treatment, and efficient reaction

Inactive Publication Date: 2011-09-14
DAREN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These studies show that the presence of native alumina on the aluminum surface has a negative impact on the rate and extent of the reaction

Method used

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  • Technique for processing and recovering disuse acidic copper etchant by metal aluminum
  • Technique for processing and recovering disuse acidic copper etchant by metal aluminum
  • Technique for processing and recovering disuse acidic copper etchant by metal aluminum

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0029] This example uses 200 ml of 25% spent etchant, added in small pieces of aluminum diamond foil with a surface area of ​​28.3 cm2 per gram.

[0030] Table of Example 1

[0031]

example 2

[0033] This example uses 200 ml of 50% spent etchant, added in small pieces of aluminum diamond foil with a surface area of ​​28.3 cm2 per gram.

[0034] Table of Example 2

[0035] time (seconds)

[0036] Obviously, the reaction of 50% solution is too violent, while the maximum temperature of 25% is only 63°C. Once the solution reached around 80°C, a runaway reaction occurred and, in other tests using slightly higher concentrations of copper, caused the solution to boil over. 70°C is an environmentally friendly upper temperature limit, which appears to be manageable. Below 40°C, the reaction is too slow for optimal industrial use.

example 3

[0038] 100% spent etchant was used, but the reaction was so violent that even a small amount of aluminum was added, and some solutions would boil over.

[0039] After the copper has been reduced, the aluminum continues to react with the free acid. This reaction is very slow compared to the copper reduction reaction. The final product will use the aluminum to completely neutralize the acid, as the pH increases significantly, the aluminum chloride hydrolyzes and the aluminum hydroxide precipitates. For the field of waste treatment, an acidic solution of aluminum chloride would be an ideal product. It will be used to treat industrial wastewater, pre-purify drinking water and precipitate solids from treated domestic sewage. The acidic aluminum chloride solution can also be used as an industrial raw material, for example for the production of polyaluminum chloride, other waste treatment compounds. This acidic solution can also be simply neutralized and sold as aluminum hydroxide...

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Abstract

The invention discloses a technology for treating and recycling waste acid copper etchant with metal aluminum. The technology first controls variables such as temperature, copper concentration of waste acid copper etchant, etc. and then adopts one or more treating spouts filled with the metal aluminum to treat the copper etchant, and then copper is separated out as metal. The technology can be used in batch or continuous mode, the treating spouts applied are connected in series or in parallel or in series-parallel and heating or cooling is carried out to control the required temperature. The inside of the treating spouts can be optionally provided with an embedded separation mechanism so as to keep solid reaction product. The treated acid etchant contains dissolved aluminum salt and can be used as chemical product or raw material for waste treatment.

Description

technical field [0001] The present invention relates to a process for recovering copper etchant, more specifically, relates to a process for utilizing metal aluminum to precipitate copper from waste acidic copper etchant, and the use of this process will not increase unwanted soluble or insoluble by-products . Background technique [0002] The printed wiring board industry typically uses acidic copper etchants to remove unwanted copper from printed wiring boards as part of the manufacturing process. The acidic copper etchant used is generally a mixture of hydrochloric acid, hydrogen peroxide and sodium chloride. It is also possible to use sodium hypochlorite or chlorate instead of hydrogen peroxide as the oxidizing agent. The combination of acid ions and oxidizing agent will corrode copper to form copper chloride. Once a sufficient amount of copper chloride is formed, when copper is in the divalent (+2) copper state, it will become an active etchant, that is, copper chlor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C02F1/70C02F103/16
Inventor 蔡荣吉罗德・A・克鲁力
Owner DAREN TECH
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