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Phosphor A containing novolac epoxy and method for producing the same

A technology of phenolic epoxy resin and phenolic resin, which is applied in the direction of plastic/resin/wax insulators, organic insulators, etc., can solve the problems of poor heat resistance and poor flame retardancy, and achieve excellent flame retardancy, small environmental impact, The effect of excellent mechanical properties

Inactive Publication Date: 2008-06-11
DONGGUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the traditionally used epoxy resins are bisphenol A type epoxy resins. After adding dicyandiamide and curing, the glass transition temperature Tg is generally less than 135°C, the heat resistance is slightly poor, and the water absorption rate is high, and the flame retardancy is also poor, which cannot be achieved. It is required that after curing, it is best to have a higher glass transition temperature, excellent flame retardancy, and excellent mechanical properties

Method used

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  • Phosphor A containing novolac epoxy and method for producing the same
  • Phosphor A containing novolac epoxy and method for producing the same
  • Phosphor A containing novolac epoxy and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Add 228g of bisphenol A, 81g of 37% formaldehyde aqueous solution and 250ml of n-butanol as a reaction medium to a reaction flask equipped with a thermometer, agitator, temperature controller and condenser tube, heat to 90°C, and add 6.3g of acidic catalyst oxalic acid , reflux reaction for 8 hours. After the reaction is completed, pressurize to remove n-butanol and water, then neutralize the above reaction mixture with 5% aqueous sodium hydroxide solution, wash with distilled water until neutral, and remove water under reduced pressure to obtain bisphenol A phenolic resin.

[0028] In another reaction flask equipped with a thermometer, a stirrer, and a condenser tube, add 30g of the bisphenol A type phenolic resin obtained by the above reaction and 90g of epichlorohydrin, and after dissolving, add 0.5g of the phase transfer catalyst hexadecyltri Methyl ammonium bromide, reacted at 95°C for 3 hours, cooled to 50°C, then added dropwise 24g10% alkaline catalyst sodium hyd...

Embodiment 2

[0031] Add 228g of bisphenol A, 81g of 37% formaldehyde aqueous solution and 250ml of n-butanol as a reaction medium to a reaction flask equipped with a thermometer, agitator, temperature controller and condenser, heat to 100°C, and add 6.3g of acid catalyst oxalic acid , reflux reaction for 6 hours. After the reaction is completed, pressurize to remove n-butanol and water, then neutralize the above reaction mixture with 5% aqueous sodium hydroxide solution, wash with distilled water until neutral, and remove water under reduced pressure to obtain bisphenol A phenolic resin.

[0032]In another reaction flask equipped with a thermometer, a stirrer, and a condenser tube, add 30g of the bisphenol A type phenolic resin obtained by the above reaction and 120g of epichlorohydrin, and after dissolving, add 0.6g of the phase transfer catalyst hexadecyltri Methyl ammonium bromide, react at 100°C for 3 hours, cool down to 55°C, then dropwise add 30g of 10% aqueous sodium hydroxide solut...

Embodiment 3

[0035] Add 228g of bisphenol A, 90g of 37% formaldehyde aqueous solution and 250ml of n-butanol as a reaction medium to a reaction flask equipped with a thermometer, agitator, temperature controller and condenser tube, heat to 90°C, and add 8g of acid catalyst citric acid . The reaction was refluxed for 6 hours. After the reaction is completed, pressurize to remove n-butanol and water, then neutralize the above reaction mixture with 5% aqueous sodium hydroxide solution, wash with distilled water until neutral, and remove water under reduced pressure to obtain bisphenol A phenolic resin.

[0036] In another reaction flask equipped with a thermometer, a stirrer, and a condenser tube, add 30g of the bisphenol A type phenolic resin obtained by the above reaction and 140g of epichlorohydrin, and after dissolving, add 0.7g of the phase transfer catalyst hexadecyltri Methyl ammonium bromide, react at 100°C for 3 hours, cool down to 65°C, add dropwise 30g of 10% sodium hydroxide aque...

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Abstract

The invention relates to the technical field of novolac epoxy resin, in particular to a bisphenol A novolac epoxy resin containing phosphorous and a relative preparation method, wherein the compound formula is represented as below, n is 0-7. The invention condensates formaldehyde or cavaform and bisphenol A in the presence of acid catalyst to prepare phenol resin compound, processes etherification with epichlorohydrin in the presence of phase transfer catalyst, generates bisphenol A novolac epoxy resin in the presence of alkal catalyst, and reacts the bisphenol A novolac epoxy resin with organic phosphorous compound in the presence of catalyst to obtain bisphenol A novolac epoxy resin containing phosphorous. The solid product has good thermal resistance, flameproof, mechanical property and wide application in the technical fields of laminated board, insulated material, semi-conductor package and composite material.

Description

Technical field: [0001] The invention relates to the technical field of novolak epoxy resin, in particular to an electrical insulating material with excellent properties such as high heat resistance, high strength, halogen-free flame retardancy, etc., especially for manufacturing glass cloth, epoxy resin copper-clad laminate, or for semiconductor Phosphorus-containing bisphenol A novolac epoxy resin for encapsulating and fiber-reinforced composite material matrix and its preparation method. Background technique: [0002] Epoxy resin is widely used as matrix resin for copper clad laminates and semiconductor packaging plastics due to its comprehensive properties such as good insulation, heat resistance, mechanical properties, and adhesion to various substrates. The largest amount of a class of thermosetting resins. With the development of electronic equipment in the direction of miniaturization and high performance, PCB wiring density is getting higher and higher. Ultra-large...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G59/08H01B3/40
Inventor 刘志猛叶坤蒋欣刘煜平
Owner DONGGUAN UNIV OF TECH
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