Temperature gradient controllable wafer front-drying method and its hot plate type front drying device

Abstract

The present invention relates to a prebaking method and a hot disk-type prebaking device for chips, the temperature gradient of the present invention is controllable; the method is through adopting fuzzy control theory and three closed-loop approach of the temperature of a hot disk, the position and temperature of a chip, the position changing of the chip in the hot disk can be accurately traced and the temperature gradient and changing process of a glue film on the chip can be controlled; the device comprises a furnace body, a hot disk body, a heater and a temperature detection device, a chip top rod, a lifting mechanism; the furnace body has an upper cover with an extracting opening and a door for the chip accessing; the hot disk body is arranged in the furnace body; a heater and a temperature detection device are arranged in the hot disk body and connected electrically with the hot-disk temperature controller; the chip top rod is arranged on the hot disk body and the bottom of the chip top rod goes through the hot disk body and to connect the lifting mechanism; the output shaft of the lifting mechanism which is connected with a servo controller by a motor is provided with a coder which is connected with the bottom of the top rod by a leadscrew; the present invention can strictly control temperature, time and warming speed, and can gain the best characteristics of glue film and best lithography effects and finally can produce semiconductor devices with high integration level and high reliability.

Description

technical field [0001] The invention relates to semiconductor integrated circuit chip manufacturing technology, and specifically describes a pre-baking method with controllable temperature gradient and a hot-disk type pre-baking device. technical background [0002] In the manufacturing process of semiconductor integrated circuit chips, it is necessary to use photolithography, a micro-processing method, to repeatedly groove, open windows, punch holes, and build platforms on various thin films of the substrate. processing. The prerequisite for ensuring the precision of photolithographic microfabrication is to accurately transfer the pattern to be processed to the substrate. The pattern transfer accuracy is completely determined by the photolithographic effect. The medium of pattern transfer is photocorrosion agent, commonly known as photoresist; the formation of a good film depends first on the performance of the coating equipment, and the pre-baking after coating also plays...

AI Technical Summary

Problems solved by technology

[0009] In order to overcome the deficiency that the existing traditional HP hot plate cannot directly control the wafer temperature and obtain the best photoresist quality adhesive film in the pre-baking process, the purpose of the present invention is to provide a pre-baking method with controllable temperature gradient and its pre-baking method. The heating plate pre-baking device starts from the corresponding relationship between temperature and time, and applies fuzzy control theory to the pre-baking process of HP hot plate

Images