Microelectronic element with elastic conductive projection and method of manufacture

Abstract

The invention provides a micro-electronics component which has an elastic electric conduction ridge, including the semiconductor chip and conductance ridge which establishes on the semiconductor chip surface, its characteristic lie in: the conductance ridge includes a conducting layer and an elastic conducting layer, the conducting layer electric interlocks with the semiconductor chip surface weld pad, the elastic conducting layer connects with the conducting layer metallurgy. Simultaneously it provided the manufacture method of the micro-electronics component, as well as the seal structure and the liquid crystal display installment. According to the invention, no need to use anisotropy conducting resin coating, the obtained seal structure compares to which used the anisotropy conducting resin coating, it has the lower connection resistance, simultaneously avoids short-circuiting occurrence.

Description

technical field [0001] The invention relates to the technical field of microelectronics, and specifically provides a microelectronic element with elastic conductive bumps, including a packaging structure of the microelectronic element, a liquid crystal display device, and a manufacturing method of the microelectronic element. Background technique [0002] In the existing microelectronics manufacturing technology field, flip chip (Flip Chip, FC) technology using anisotropic conductive film (Anisotropic Conductive Film, ACF) as the interconnection medium plays a very important role. Take the currently commonly used ACF as an example. It is composed of a high molecular polymer and conductive particles uniformly dispersed in it. The diameter of the conductive particles is about 3 to 5 microns. It is usually a resin particle with a conductive metal material on the surface. . [0003] Among the existing flip-chip technologies, the widely used manufacturing process of ACF mainly i...

AI Technical Summary

Problems solved by technology

A problem brought about by this is that the number of conductive particles between the conductive bump and the connection terminal becomes too small due to the escape of conductive particles during the packaging process, which increases the connection resistance and even causes an open circuit

Another problem brought about by this is: too many conductive particles are concentrated between adjacent conductive bumps, forming a lateral electrical connection, that is, causing a short circuit to adjacent conductive bumps and adjacent connection terminals

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