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Polyimide multilayered adhesive film and process for producing the same

A polyimide layer, polyimide technology, used in chemical instruments and methods, film/sheet adhesives, adhesives, etc. problem, to achieve the effect of continuous productivity and uniform film thickness and size

Inactive Publication Date: 2007-11-28
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The problem in the above manufacturing method is that it is difficult to adjust the thickness of the continuously manufactured adhesive film approximately in real time
However, each layer of this adhesive film is formed of polyimide resins that have different high heat resistance and thermoplastic properties, but have very similar molecular structures. Therefore, the difference in infrared absorption intensity of each layer is converted into thickness Infrared absorption method, there is a problem that it is difficult to measure the thickness accurately

Method used

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  • Polyimide multilayered adhesive film and process for producing the same
  • Polyimide multilayered adhesive film and process for producing the same
  • Polyimide multilayered adhesive film and process for producing the same

Examples

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Embodiment

[0162] Hereinafter, an example of the method of the present invention will be given and described in detail, but the present invention is not limited to this example.

Synthetic example 1

[0163] (Synthesis Example 1: Synthesis of polyamic acid as a precursor of highly heat-resistant polyimide compounds)

[0164] Add 76.2kg of DMF cooled to 10°C, 3.7kg of p-phenylenediamine (PDA), and slowly add 9.8kg of 3,3',4,4'-biphenyltetracarboxylic acid di Anhydride (BPDA), stirred for 30 minutes. Separately, a solution obtained by dissolving 300 g of BPDA in 2 kg of DMF was prepared, and this was slowly added to the above-mentioned reaction solution while paying attention to the viscosity, followed by stirring. When the viscosity reached 3500 poise, the addition and stirring were stopped to obtain a solution of polyamic acid which is a precursor of a highly heat-resistant polyimide compound.

[0165] In this synthesis example, when the thickness of each layer was measured by an infrared absorption method, there was no functional group exhibiting a characteristic infrared absorption wavelength.

Synthetic example 2

[0166] (Synthesis Example 2: Synthesis of polyamic acid as a precursor of highly heat-resistant polyimide compounds)

[0167] 6.9kg of 4,4'-oxydianiline (hereinafter also referred to as ODA), 6.2kg of p-phenylenediamine (hereinafter also referred to as p-PDA), 9.4kg of 2,2-bis[4- (4-Aminophenoxy) phenyl] propane (hereinafter also referred to as BAPP) was dissolved in 239 kg of N, N-dimethylformamide (hereinafter also referred to as DMF) cooled to 10 ° C, and 10.4 kg of Pyromellitic dianhydride (hereinafter also referred to as PMDA) was stirred for 1 hour and dissolved. 20.3 kg of benzophenone tetracarboxylic dianhydride (hereinafter also referred to as BTDA) was added there, and stirred for 1 hour to dissolve it.

[0168] The DMF solution of PMDA prepared separately (PMDA:DMF=0.9kg:7.0kg) was slowly added to the above reaction solution, and the addition was stopped when the viscosity reached about 3000 poise. Stirring was performed for 1 hour to obtain a solution of polyamic...

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Abstract

This invention provides a polyimide multilayered adhesive film, which can accurately measure the thickness of each layer by a infrared absorption method, and a process for producing the same. The adhesive film comprises a highly heat-resistant polyimide layer, and an adhesive layer containing a thermoplastic polyimide and provided on at least one surface of the highly heat-resistant polyimide layer. The adhesive film is produced by a coextrusion-cast coating method and is characterized in that any one of the highly heat-resistant polyimide layer and the adhesive layer is composed mainly of a polyimide resin containing a functional group which exhibits a characteristic infrared absorption wavelength. Thereafter, in the step of measuring the film thickness, the film thickness of each layer is measured with an infrared light absorption-type film thickness measuring meter, and, based on the resultant film thickness measured data, the film thickness of each layer during film formation is controlled and regulated for the production of the polyimide multilayered adhesive film.

Description

technical field [0001] The present invention relates to a multilayer adhesive film in which an adhesive layer containing thermoplastic polyimide is provided on at least one side of a highly heat-resistant polyimide layer, and the thickness of each layer is controlled, and is used for producing the film in which each layer is controlled Thick film technology. Background technique [0002] In recent years, with the reduction in weight, size, and density of electronic products, the demand for various printed circuit boards has increased. Among them, the demand for flexible laminates (also referred to as flexible printed wiring boards (FPC), etc.) has increased in particular. . The flexible laminate has a structure in which a circuit including a metal foil is formed on an insulating film. [0003] The above-mentioned flexible laminate is generally formed of various insulating materials, and a flexible insulating film is used as a substrate. On the surface of the substrate, met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B32B27/34C09J179/08
Inventor 栁田正美上岛健二小松利幸
Owner KANEKA CORP
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