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Chemical copper plating solution and technique thereof

An electroless copper plating, solution technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve problems such as poor stability and rapid decomposition

Inactive Publication Date: 2007-11-28
MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, to address this problem, some formaldehyde-free electroless copper plating solutions have been developed, however, most of the conventional formaldehyde-free electroless copper plating solutions have poor stability due to their high reactivity and decompose quickly when used

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Prepare electroless copper plating solution by following formula:

[0020] Copper sulfate pentahydrate 2g / L

[0021] Iron sulfate heptahydrate 0.3g / L

[0022] Sodium Potassium Tartrate 4g / L

[0023] Sodium hypophosphite 5g / L

[0024] Ammonium sulfate 0.8g / L

[0025] Thiourea 0.01g / L

[0026] Use sulfuric acid and concentrated ammonia water to adjust the pH value of the above solution to 12, then take a sample of plastic plate and roughen and activate it, wash it with water and then soak it in the above electroless copper plating solution at room temperature for 10 minutes, the copper plating is complete After washing with water, then immerse in an acidic solution for conductive treatment for 3 minutes, and then perform electroless nickel-copper-phosphorus alloy plating after washing again, and the finally obtained surface film can pass 8 hours of salt spray test, and its resistance and attachment Efforts can reach industry standards.

Embodiment 2

[0028] Prepare electroless copper plating solution by following formula:

[0029] Copper sulfate pentahydrate 3g / L

[0030] Iron sulfate heptahydrate 0.2g / L

[0031] Sodium Potassium Tartrate 3g / L

[0032] Sodium hypophosphite 4g / L

[0033] Ammonium sulfate 1g / L

[0034] Thiourea 0.01g / L

[0035] Use sulfuric acid and concentrated ammonia water to adjust the pH value of the above solution to 11, then take a plastic plate sample and roughen it to activate it, wash it with water and then soak it in the above electroless copper plating solution at room temperature for 10 minutes, the copper plating is complete After washing with water, then immerse in an acidic solution for conductive treatment for 3 minutes, and then perform electroless nickel-copper-phosphorus alloy plating after washing again, and the finally obtained surface film can pass 8 hours of salt spray test, and its resistance and attachment Efforts can reach industry standards.

Embodiment 3

[0037] Prepare electroless copper plating solution by following formula:

[0038] Copper sulfate pentahydrate 2g / L

[0039] Ferric sulfate heptahydrate 0.5g / L

[0040] Sodium Potassium Tartrate 5g / L

[0041] Sodium hypophosphite 6g / L

[0042] Ammonium sulfate 1g / L

[0043] Thiourea 0.01g / L

[0044] Use sulfuric acid and concentrated ammonia water to adjust the pH value of the above solution to 13, then take a plastic plate sample and roughen and activate it, wash it with water, and then soak it in the above electroless copper plating solution at room temperature for 10 minutes, and the copper plating is complete. After washing with water, then immerse in an acidic solution for conductive treatment for 3 minutes, and then perform electroless nickel-copper-phosphorus alloy plating after washing again, and the finally obtained surface film can pass 8 hours of salt spray test, and its resistance and attachment Efforts can reach industry standards.

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PUM

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Abstract

A kind of chemical solution used to copperize, the following are the weight percent of the major components of it: blue vitriod0.8-3, Fe vitriol 0-0.5, complex agent 3-6, sodium hypophosphorous acid 4-6, ammonia sulfate 0.5-1, sulfourea 0-0.01. The following is the procedure of the copper coating method with the above copper coating solution: to widen and activate the plastic board->to clean->to make it electric->to clean->to coat nickel-copper alloy on it by chemical method. The following are the content of the chemical method: the plastic pretreated according the above description will be immersed in the above chemical solution used to copperize, the pH of which has been adjusted to 10-13 by vitriol and stranger ammonia water, the working temperature of it is 20-70deg.C, the time to copperize is 5-20 minutes. The chemical solution used to copperize in this patent does not contain formaldehyde, it improve the working circumstance, and is easy to control, the cost of it is lower, and it own high economical benefit and society benefit.

Description

technical field [0001] The invention relates to a surface treatment process, in particular to a novel electroless copper plating solution and process. Background technique [0002] The traditional electroless copper plating process uses formaldehyde as a reducing agent, and EDTA and potassium sodium tartrate as a single or mixed complexing agent. Among them, the formaldehyde used has serious environmental pollution, and its smell is unpleasant, teratogenic, and carcinogenic. Mutagenicity, carcinogenicity. Therefore, to address this problem, some formaldehyde-free electroless copper plating solutions have been developed, however, most of the conventional formaldehyde-free electroless copper plating solutions have poor stability due to their high reactivity, and decompose quickly when used. Therefore need to develop the formaldehyde-free electroless plating solution with high stability, and use it can finish electroless copper plating process rapidly. Contents of the invent...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 高原
Owner MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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