Adhesive film and method for manufacturing semiconductor device using same

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, film/sheet-like adhesives, etc., can solve problems such as peeling problems, and achieve excellent shear strength characteristics and excellent fracture characteristics Effect

Inactive Publication Date: 2007-08-08
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since their adhesives also use acrylic resin adhesives, there is a problem of peelability during pickup, so they are handled by using a special release agent
In addition, there is also a problem that the attachment temperature at the time of wafer attachment is required to be attached at a high temperature of 100°C or higher.

Method used

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  • Adhesive film and method for manufacturing semiconductor device using same
  • Adhesive film and method for manufacturing semiconductor device using same
  • Adhesive film and method for manufacturing semiconductor device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0146] Hereinafter, the present invention will be described in further detail through examples, but the present invention is not limited to these examples.

Synthetic example

[0149] (I) Thermosetting adhesive components

[0150] (I-1) Epoxy compound (manufactured by Mitsui Chemicals, Inc., VG3101)

[0151] (I-2) Imidazole-based curing agent (Shikoku Chemical Industry Co., Ltd., 2MAOK-PW)

[0152] (II) Silica-based filler (manufactured by Ryusen Co., Ltd., 1-FX)

[0153] (III) Synthesis example of polyimide resin component

Synthetic example 1

[0155] In a 30 ml five-necked separable flask with a stirrer, a nitrogen inlet tube, a thermometer, and a Dean Stark tube filled with mesitylene, quantitatively add 4,4′-bis(3 -aminophenoxy)biphenyl 17.00g, polytetrahydrofuran-di-p-aminobenzoate (manufactured by Ihara Chemical Industry Co., Ltd., trade name: Erasma-1000, average molecular weight 1305) 40.14g, N-methyl- 86.37 g of 2-pyrrolidone and 37.09 g of mesitylene were heated to 50° C. in a nitrogen atmosphere to dissolve them, and then 25.05 g of oxy-4,4′-diphthalic dianhydride was gradually added in small amounts. Then, a nitrogen gas introduction tube was inserted (foaming state), and the temperature in the system was heated to 170° C. to 180° C. to azeotropically remove water while maintaining it for 10 hours. After cooling, 61.67 g of N-methyl-2-pyrrolidone and 26.49 g of mesitylene were added and diluted to obtain a solution of polyimide (III-1). After making a solution in N-methyl-2-pyrrolidone with a concentratio...

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PUM

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Abstract

Disclosed is an adhesive tape serving as a dicing tape in a dicing step which has excellent dicing properties and pick-up properties. Also disclosed is a bonding tape exhibiting excellent bonding reliability in a step for bonding a semiconductor element and a supporting member. Specifically disclosed is an adhesive film including a layer wherein an adhesive layer (A) containing an olefin polymer and another adhesive layer (B) are directly joined together. The adhesive film is characterized in that the 180 DEG peel strength between the layer (A) and the layer (B) is not more than 0.7 N / 10 mm.

Description

technical field [0001] The present invention relates to an adhesive film used for manufacturing semiconductor devices such as ICs and LSIs, and a method of using the same. Background technique [0002] Semiconductor wafers such as silicon and gallium arsenide are produced in a large-diameter state, and the wafers are diced (daising) into IC chips, followed by a die-attach process in which the IC chips are mounted on a lead frame for packaging as the next step. (die attach or chip bonding). At this time, the semiconductor wafer is cut, cleaned, dried, expanded, and picked up in the state where the adhesive sheet is pasted in advance, and then transferred to the next step of the die bonding process. As the adhesive sheet used in the process from the dicing process to the pick-up process of such a semiconductor wafer, it is preferable to have sufficient adhesion to the wafer chip in the dicing process to the drying process, and to have no adhesion to the wafer chip at the time...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J123/00C09J179/08H01L21/301H01L21/52C09J7/10H01L21/68
CPCH01L2924/01015H01L2924/0105H01L2924/01082H01L2221/68327H01L2924/01004H01L2924/01002H01L2924/30105C09J7/00H01L2924/01019H01L2924/01029H01L2924/01027C09J2203/326C09J2479/08H01L2924/014H01L2924/01013C09J2201/36H01L2224/8385C09J179/08H01L2924/01056H01L2924/01024H01L2924/0665H01L21/6836H01L2224/274H01L2224/83191H01L24/27H01L2224/2919H01L2924/01047H01L2924/01079H01L2924/01068H01L2924/14H01L24/83H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/10329H01L2924/0102H01L2924/01078H01L2924/01011H01L2924/10253H01L2924/01058B32B27/32H01L2924/07802C09J2423/00H01L2924/01051C09J7/10Y10T428/2878C09J2301/208H01L2924/00H01L2924/3512C09J123/00
Inventor 高松信博相原伸
Owner MITSUI CHEM INC
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