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Adhesive sheet

An adhesive sheet, adhesive force technology, applied in the direction of adhesives, film/sheet adhesives, electrical components, etc., can solve the problem of difficult to take into account the handleability, and achieve the effect of improving productivity and excellent handleability

Inactive Publication Date: 2013-09-11
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is difficult to balance the adhesive force suitable for various uses as an adhesive sheet and the handling properties after peeling off the separator film, such as paper passability.

Method used

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  • Adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] An ethylene-vinyl acetate copolymer (manufactured by DU PONT-MISUI CO., LTD., trade name "EVAFLEXP-1007") was used as a material for forming the base material layer.

[0067] Using an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "TAFTHREN H5002"): structural unit derived from propylene 90 mol% / derived from 1-butane 10 mol % of structural units of alkene, Mw=230000, Mw / Mn=1.8) as a material for forming the adhesive layer.

[0068] 100 parts of the above-mentioned material forming the substrate layer and 100 parts of the above-mentioned material forming the adhesive layer are put into respective extruders, and carry out T-die melt co-extrusion (extruder:

[0069] GM ENGINEERING, Inc., trade name "GM30-28" / T-die: clamp-type feeding mechanism, extrusion temperature: 180°C). The melted resin co-extruded from the die and the Si-coated PET separator (manufactured by Mitsubishi Chemica...

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PUM

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Abstract

The invention provides an adhesive sheet capable of keeping sufficient adhesive force and excellent processing properties such as paper through property and the like after an isolation film is peeled off. The adhesive sheet is provided with a matrix layer and an adhesive layer. A ball number of the adhesive layer in a roll adhesive test is smaller than 2; and an adhesive force to a silicone mirror wafer is higher than 0.3 N / 20mm. By using the adhesive sheet, the adhesive sheet taking account of the sufficient adhesive force as the adhesive sheet and the processing properties such as the paper through property and the like after an isolation film is peeled off can be obtained.

Description

technical field [0001] The present invention relates to an adhesive sheet. Background technique [0002] Semiconductor wafers are manufactured in a large-diameter state, and the back surface is ground after patterning the surface, so that the thickness of the wafer is usually reduced to about 100~600μm. Then, it is further cut and separated (dicing) into small pieces of components, and transferred to the mounting process. In the process of grinding the back surface of the semiconductor wafer (back grinding process), an adhesive sheet is used to protect the pattern surface of the semiconductor wafer. Adhesive sheets used in wafer processing require adhesive strength to the extent that they can hold wafers and prevent wafer breakage during wafer grinding, dicing, and other processes. As such an adhesive sheet, for example, an adhesive sheet in which an adhesive layer coated with an acrylic adhesive is provided on a base material containing a polyethylene-based resin has been...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J123/00C09J123/14C09J123/10H01L21/683
Inventor 高桥智一盛田美希龟井胜利土生刚志本田哲士浅井文辉
Owner NITTO DENKO CORP
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