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Curable resins and curable resin compositions containing the same

A technology of curable resin and resin composition, applied in the field of curable resin composition, can solve problems such as extremely difficult to achieve practical application, lower heat resistance or moisture resistance, and limit of safe use range, and achieve excellent reactivity, excellent The effect of heat resistance

Inactive Publication Date: 2008-04-09
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In addition, the cured film of the above-mentioned curable resin composition is extremely flammable, so in applications where flame retardancy is strongly required, the range of use is still limited in terms of safety.
Methods of imparting flame retardancy to curable resin compositions, such as adding flame retardants, are generally known methods, but when using such compositions, problems such as lowering of heat resistance and moisture resistance occur, and it is extremely difficult to achieve practical use.

Method used

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  • Curable resins and curable resin compositions containing the same
  • Curable resins and curable resin compositions containing the same
  • Curable resins and curable resin compositions containing the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0098] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device and a stirring device, a polyphenol resin (manufactured by Japan Epoxy Resin Co., Ltd., trade name: "EPIKYUA-YL6065", 98 parts of OH equivalent: 98), 0.98 parts of potassium hydroxide and 98 parts of toluene, the reaction system was replaced with nitrogen under stirring, and the temperature was raised by heating. Subsequently, 63.8 parts of propylene oxide was slowly dropped into it, and at 125 to 132 ° C, 0 to 4.8 kg / cm 2 The reaction was carried out for 16 hours. Thereafter, after cooling to room temperature, 1.28 parts of 89% phosphoric acid was added to the reaction solution, mixed, and neutralized with potassium hydroxide to obtain a polyphenol with a non-volatile content of 63.8% and a hydroxyl equivalent of 160.7 g / eq. Propylene oxide reaction solution of the resin. This is obtained by adding an average of 1.08 moles of epoxy per 1 equivalent o...

Synthetic example 2

[0103] In the autoclave with a thermometer, a nitrogen introduction device, an alkylene oxide introduction device and a stirring device, add 98 parts of polyphenol resin (manufactured by Japan Epoxy Resin Co., Ltd., trade name "EPIKUA-YL6065", OH equivalent: 98), hydrogen 0.98 parts of potassium oxide and 98 parts of toluene were used, and the reaction system was replaced with nitrogen while stirring, and the temperature was raised by heating. Subsequently, 174.0 parts of propylene oxide was slowly dropped into it, and at 125 to 132 ° C, 0 to 4.8 kg / cm 2 The reaction was carried out for 16 hours. Thereafter, after cooling to room temperature, 1.28 parts of 89% phosphoric acid was added to the reaction solution, mixed, and neutralized with potassium hydroxide to obtain a polyphenol with a non-volatile content of 75.1% and a hydroxyl equivalent of 264.5 g / eq. Propylene oxide reaction solution of the resin. This is obtained by adding an average of 2.87 moles of epoxy per 1 equi...

Synthetic example 3

[0107] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device and a stirring device, polyparahydroxystyrene resin (manufactured by Maruzen Petrochemical Co., Ltd., trade name "Maerca-M", OH equivalent: 120) was added. 120 parts, 1.2 parts of potassium hydroxide and 120 parts of toluene, the reaction system was replaced with nitrogen under stirring, and the temperature was raised by heating. Subsequently, 63.8 parts of propylene oxide was slowly dropped into it, at 125 to 132 ° C, 0 to 4.8 kg / cm 2 The reaction was carried out for 16 hours. Thereafter, after cooling to room temperature, 1.57 parts of 89% phosphoric acid was added to the reaction liquid, mixed, and neutralized with potassium hydroxide to obtain poly-p-hydroxyl with 62.0% non-volatile content and 182 g / eq. Propylene oxide reaction solution of styrene resin. This is obtained by adding an average of 1.07 moles of epoxy per 1 equivalent of phenolic hyd...

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Abstract

There is provided a curable resin having an unsaturated group and a carboxyl group at the terminals of its side chains, such as a curable resin obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a compound having three or more phenolic hydroxyl groups in its molecule (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). By compounding such a curable resin with a photopolymerization initiator, a photosensitive (meth)acrylate compound, an epoxy compound, a diluent solvent, another curable resin which has a carboxyl group and an unsaturated group in its molecule and which is in the state of solid at room temperature, a flame-retardant, etc., there is obtained a photocurable and thermosetting resin composition which is useful for the formation of a solder resist of a printed circuit board, an interlaminar insulating layer of a multi-layer circuit board, or the like.

Description

technical field [0001] The present invention relates to a curable resin having an unsaturated group and a carboxyl group at a side chain terminal, and a curable resin composition containing the curable resin. More specifically, the present invention relates to a solder paste having excellent solder heat resistance, PCT (autoclave test) resistance, excellent adhesion, chemical resistance, electroless gold plating resistance, electrical insulation, resistance A curable resin that cures a film such as hygroscopicity, and a curable resin composition containing the curable resin. [0002] The present invention also relates to a solder resist suitable for printed circuit boards, which can provide excellent dryness to touch and developability after pre-drying, and has excellent adhesion, solder heat resistance, chemical resistance, resistance Hygroscopicity, resistance to electroless gold plating, PCT resistance, electrical insulation, flame retardancy and other cured photocurable a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28C08F290/02C08F8/00C08G59/16
Inventor 釜萢裕一小桧山登
Owner TAIYO HLDG CO LTD
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