Composite resin plate

A technology of resin composite and board, applied in the field of composite board manufacturing, can solve the problems of poor tensile resistance, waterproof and wear resistance, loose particles, low internal bonding strength, etc., to achieve sanitation and good tensile resistance. and wear resistance

Inactive Publication Date: 2007-10-17
阳东县有源复合材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of board can make excellent use of waste industrial plastics to make recycled resources, but because the resin fiber is a mixture of polymer and glass fiber, it is not easy to be bonded by ordinary adhesives, even if it is barely bonded, this type of board It is very easy to have bad phenomena such as particle loosening and low internal bonding strength, and the stretch resistance, waterproof and wear resistance are extremely poor

Method used

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  • Composite resin plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A resin composite plate, comprising the following raw materials in weight percentage: 30-50% of plastic powder, 40-55% of resin fiber powder, 4-22% of butadiene rubber, 3-5% of fiber adhesive, and 0.2% of triphenyl phosphite ~0.4%.

[0042] To achieve the best effect of the board, the percentage by weight of each raw material should be kept as follows: 30% of plastic powder, 50% of resin fiber powder, 14.6% of butadiene rubber, 5% of fiber cement, and 0.4% of triphenyl phosphite.

[0043] Production method: In this embodiment, resin fiber powder is used as the main raw material, plastic powder is added as the auxiliary raw material, the two powders are dried separately and then fully mixed, then the butadiene rubber adhesive, fiber adhesive and modifier sub Triphenyl phosphate, after fully mixing the powders, place them in a mold with a gauge pressure of 10KPa to 20Kpa at 190°C to 250°C for compression molding, and the formed boards are glued with butadiene glue and fib...

Embodiment 2

[0049] A resin composite plate, comprising the following raw materials in weight percentage: 20-30% of plastic powder, 50-70% of resin fiber powder, 7-20% of adhesive, and 2-15% of modifier; the adhesive is phenolic Resin, described modifying agent is the mixture of aluminum hydroxide, calcium stearate, nano calcium carbonate.

[0050] The optimum weight percentages of the above raw materials are: 20% of plastic powder, 50% of resin fiber powder, 15% of phenolic resin, 4% of aluminum hydroxide, 3% of calcium stearate and 8% of nanometer calcium carbonate.

[0051] In this embodiment, the modifier calcium stearate and nano-calcium carbonate are used to effectively increase the toughness of the board and prevent the board from being crushed due to excessive rigidity, and the nano-calcium carbonate is used as a fine filler to effectively fill the plastic powder and The gap between the resin fiber powder makes the board bonding effect better and can form a smooth surface on the bo...

Embodiment 3

[0054] A resin composite board, comprising the following raw materials in weight percentage: 20-30% of plastic powder, 30-50% of resin fiber powder, 8-25% of adhesive, and 15-20% of modifier; the adhesive is phenolic Resin, described modifying agent is wood fiber powder.

[0055] The optimum weight percentages of the above raw materials are: 20% of plastic powder, 50% of resin fiber powder, 15% of phenolic resin and 15% of wood fiber powder.

[0056] Its production method is as shown in Example 1.

[0057] Also can adopt following percentage by weight in order to reach better effect in the present embodiment: plastic powder 30%, resin fiber powder 30%, phenolic acid resin 25%, wood fiber powder 15%; Or be: plastic powder 25% %, resin fiber powder 47%, phenolic resin 8%, wood fiber powder 20%.

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Abstract

The composite resin plate is made of material including plastic powder 20-60 wt%, resin fiber powder 30-70 wt%, adhesive 7-25 wt% and modifier 0.2-25 wt%. The adhesive is one or several of cis-butadiene adhesive, fiber adhesive, BR, phenolic acid resin and uric acid resin; and the modifier is one or several of lignocellulose powder, aluminum hydroxide, calcium stearate, triphenyl phosphite and nanometer calcium carbonate. The present invention adds proper adhesive and modifier in treating waste resin fiber powder and uses plastic powder as supplementary material to make the composite resin plate heat resistant, fireproof, waterproof, anticorrosive, mildewproof, tension resistant, wear resistant and widely applicable.

Description

technical field [0001] The invention relates to the technical field of composite sheet manufacturing, in particular to a composite sheet formed by pressing industrial waste. Background technique [0002] At present, with the promotion of the world economy, various industries have been greatly developed, especially in the communication electronics industry, which has brought about serious electronic waste pollution problems while driving the national economy of our country. Industrial waste---resin fiber powder, because the main component of resin fiber is a mixture of polymer and glass fiber, and these polymers are difficult to be reduced and decomposed after polymerization and curing, and the amount is huge and cannot be degraded naturally A large amount of industrial waste has brought great difficulties to environmental governance. There are also composite boards made of other industrial wastes (waste plastics), such as the patent document named as Chinese Patent No. 0321...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B18/20C04B16/04C04B26/02C04B16/02C04B22/06C04B22/10
CPCY02W30/91
Inventor 宋金有
Owner 阳东县有源复合材料科技有限公司
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