The invention relates to an
etching-first and packaging-later manufacturing method for a
chip formal double-surface three-dimensional circuit and a packaging structure of the
chip formal double-surface three-dimensional circuit. The method comprises the following steps of taking a
metal substrate; pre-plating
copper on the surface of the
metal substrate;
coating the surface of the
metal substrate with green paint; removing a part of the green paint from the back surface of the
metal substrate; electro-plating an
inert metal circuit layer; electro-plating a metal circuit layer;
coating the back surface of the
metal substrate with the green paint; removing a part of the green paint from the back surface of the
metal substrate; electro-plating the metal circuit layer;
coating the back surface of the metal substrate with the green paint; removing a part of the green paint from the back surface of the metal substrate; coating a circuit screen board; pre-
processing of metallization; removing the circuit screen board; electro-plating the metal circuit layer; coating the back surface of the metal substrate with the green paint; removing a part of the green paint from the front surface of the metal substrate; chemical-
etching; electro-plating the metal circuit layer; coating bonding materials; installing a
chip; bonding with metal wires; packaging; tapping at the back surface of the metal substrate; cleaning; implanting a metal ball; and
cutting a finished product. The method disclosed by the invention has the beneficial effects that the manufacturing cost is lowered, the safety and the reliability of a packaging body are increased, the environment
pollution is reduced, and the design and the manufacturing of a high-density circuit can be really realized.