The invention provides a packaging device of a compact single-phase integrated drive circuit. The packaging device comprises wire-leading frame, a plurality of first chip paddles formed on the wire-leading frame, first grid electrode drive devices, second grid electrode drive devices, first upper arm transistors, first lower arm transistors, second upper arm transistors, second lower arm transistors, signal pins, and power pins, wherein each first grid electrode drive device, each second grid electrode drive device, each first upper arm transistor, each first lower arm transistor, each second upper arm transistor, and each second lower arm transistor are arranged on each first chip paddle, and each signal pin and each power pin are led from each first chip paddle and arranged oppositely on tow sides of the wire-leading frame. The invention further provides the single-phase integrated drive circuit, aims at solving the problems that drive circuit devices formed by discrete components are difficult in installation and poor in reliability due to large amount, and is particularly suitable for solving the problems that center distances of the pins are reduced due to the fact that packaging size is limited in integrated drive circuits, and thereof the pins are damaged with one another due to the fact that the center distances are not enough.