Method and device for producing granulated polycrystalline silicon in a fluidized bed reactor

Abstract

A fluidized bed process for the production of polycrystalline silicon granules supplies, in addition to reaction gas, a gas containing 99.5 to 95 mol. percent hydrogen and 0.5 to 5 mol. percent gaseous silicon compounds, and the reactor wall is maintained at the same or a higher temperature than the reaction zone, such that the deposition of silicon on reactor internals is minimized.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is the U.S. national phase of PCT Appln. No. PCT / EP2006 / 065943 filed Sep. 4, 2006 which claims priority to German application DE 10 2005 042 753.7 filed Sep. 8, 2005.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a method and a device for producing granulated polycrystalline silicon in a fluidized bed reactor.[0004]2. Description of the Related Art[0005]Highly pure polycrystalline silicon is used inter alia for the production of electronic components and solar cells. It is obtained by thermal decomposition of a gas containing silicon or a gas mixture containing silicon.[0006]This process is referred to as chemical vapor deposition (CVD). On an industrial scale, this process is carried out in so-called Siemens reactors.SUMMARY OF THE INVENTION[0007]Most recently, there have been many efforts to use a continuous fluidized bed method as an alternative to the Siemens batch method. Thes...

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Benefits of technology

[0008]Application US 2002 / 0102850 A1 (Kim) describes a method and an apparatus for avoiding or removing silicon deposition on educt gas nozzles by continuous, discontinuous or regulated injection of HCl+inert gas (H2, N2, He, Ar) or inert gas H2. The operating costs disadvantageously increase with such process management, since the conversion ratio and therefore the reactor space-time yield is reduced by HCl dosing. The use of electronics grade HCl furthermore requires additional process steps for purification and to maintain purity, and therefore entails an increased contamination risk and higher starting material costs.

[0038]Insulation (16) is preferably arranged around the inner reactor tube (3) in order to reduce energy losses.

Problems solved by technology

In practice, however, deposition of silicon on the hot reactor parts, for example the reactor wall, installed components and nozzles leads to thermo-mechanical loading of the reactor and therefore to reactor outages owing to heat stagnation on the reactor surfaces.

The operating costs disadvantageously increase with such process management, since the conversion ratio and therefore the reactor space-time yield is reduced by HCl dosing.

The use of electronics grade HCl furthermore requires additional process steps for purification and to maintain purity, and therefore entails an increased contamination risk and higher starting material costs.

This patent also discloses that deposition takes place on walls at temperatures in excess of 400° C. and cooling the wall is uneconomical owing to the energy loss.

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