Apparatus and method for manufacturing semiconductor grains
a technology of semiconductor grains and apparatuses, applied in the direction of manufacturing tools, sustainable manufacturing/processing, final product manufacturing, etc., can solve the problems of low productivity, and achieve the effect of preventing particle formation on the inner wall of the crucible and high conversion efficiency
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first embodiment
[0042]FIG. 1 is a view showing a crucible for manufacturing a semiconductor grains of an embodiment of the present invention. Numeral 1 indicates the whole of the crucible, and numeral 2 indicates a body member, numeral 3 indicating a nozzle member.
[0043]The crucible 1 comprises the cylindrical body member 2 and the disk-shaped nozzle member 3 fitted to the bottom portion of the body member 2.
[0044]The body member 2 comprises an inner wall member 2a having an inner wall hindering reaction with silicon and an outer wall member 2b disposed outside the inner wall member 2a. The outer wall member 2b is provided for reinforcing the body member 2. A screw 4 is threaded on each of the outside of the inner wall member 2a and the inside of the outer wall member 2b.
[0045]Each of the inner wall member 2a and the outer wall member 2b are formed of a sintered body compacted by casting, hot press or the like. Aluminum oxide, silicon carbide, graphite or the like is suitable for hindering reactio...
example 1
[0059]A nozzle members 3 having nozzle holes 3a of variety of diameters respectively worked by laser machining was manufactured to assemble a crucible. Then silicon in the crucible was melted and silicon grains were manufactured, and the diameters and crystal qualities of the obtained silicon grains were evaluated.
[0060]The test was carried out as follows.
[0061]18 grams of silicon material was filled into a crucible in an atmosphere of an inert gas such as Ar or He kept at a temperature of 1450° C. through a passage being similarly in an inert gas atmosphere, and melted. The crucible was formed of graphite (graphite DFP-2 manufactured by POCO Graphite, Inc. or the like) having dimensions of 19.0 mm φ in the inner diameter, 25.0 mm φ in the outer diameter and 143 mm in length. Variously changed gaseous pressures were applied to the sufficiently melted material to spray and discharge the whole amount of the molten material straight out through a nozzle hole. At this time, with the gas...
second embodiment
[0068]In this second embodiment, when silicon material is put into a crucible 1 and the whole of the silicon material is melted by the use of an induction heater or a resistance heater (not shown), grains acting as cores of crystallization are added to the silicon material.
[0069]These grains as cores of crystallization are preferably hard to react in the silicon molten solution. Grains of various kinds of materials can be used, if they do not change their shape or disperse as impurities to cause to lower the semiconductor quality. For example, aluminum oxide, silicon oxide, diamond, graphite or the like can be preferably used.
[0070]The silicon molten solution is pressed from above by argon gas or the like, for example, not more than 0.5 MPa to be extruded from the nozzle hole 3a of the nozzle member 3, so that the silicon molten solution is sprayed to make a number of drops. These drops of the silicon molten solution are allowed to free-fall. During falling, the drops are solidified...
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