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Short-wavelength laser module and method of producing the same

a laser module and short-wavelength technology, applied in the direction of semiconductor lasers, active medium materials, instruments, etc., can solve the problems of lowering the output of blue light, losing long-term reliability, and lowering the output of optical outpu

Inactive Publication Date: 2005-01-25
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a short-wavelength laser module that can improve performance and achieve stable output with high reliability. The module includes a light-emitting device, a package body, a lid portion, and an adhesive. The adhesive is used to bond the package body to the lid portion and seals the module. The short-wavelength laser module has a sealing face between the adhesive and the housing space, which ensures stability and long-term reliability. The module can be produced using a method that involves securing the light-emitting device using an adhesive cured by ultraviolet light, and then sealing the package body to create a vacuum or inert gas atmosphere. The module is designed to have translucency and the adhesive is exposed to ultraviolet light to accelerate its polymerization. The invention also provides a communication apparatus that uses the short-wavelength laser module for transmitting information through light."

Problems solved by technology

However, short-wavelength light emitted from a short-wavelength semiconductor laser, such as a blue laser, or an optical waveguide, is coherent light, and large energy of 10 kW / cm2 or more is concentrated near the end face of the laser chip or the light-emitting point of the optical waveguide; therefore, the particles of the unnecessary gas are attracted thereto, and the unnecessary gas present inside the package are deposited on the end face of the chip or the end face of the optical waveguide, that is, the light emission portions, thereby causing the problem of lowering the optical output.
In addition, in the case when an ultraviolet curing resin is used as a package sealing and securing agent and an optical waveguide wavelength conversion device securing agent, bluish violet light or ultraviolet light emitted from the semiconductor laser or the optical waveguide reacts with outside gas, that is, unnecessary caused by the ultraviolet curing resin present in the atmosphere inside the package, and the unnecessary gas is further deposited significantly on the end face of the optical waveguide, thereby causing the problem of losing long-term reliability.
Furthermore, in the case when the optical waveguide wavelength conversion device is turned on continuously in the air atmosphere without being secured to the inside of the package, large energy is concentrated to the end face of the optical waveguide; therefore, foreign particles, such as dust, dirt and carbide, present in the air, are deposited on the end face of the blue light emission portion, thereby causing the problem of lowering the output of the blue light, deteriorating the transverse mode and losing the long-term reliability.

Method used

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  • Short-wavelength laser module and method of producing the same
  • Short-wavelength laser module and method of producing the same
  • Short-wavelength laser module and method of producing the same

Examples

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example 2

When the operating temperature and storage temperature of the SHG blue light source rise, it is necessary to set a heat treatment temperature so as to be higher than the operating temperature and storage temperature in order to prevent the generation of unnecessary gas; in addition, as the heat treatment process at that time, it is necessary to set a process wherein the influence due to thermal diffusion to the optical waveguide portion can be neglected. When using the SHG blue light source as an optical disc light source, it is necessary to use a heat treatment process of 85° C. or more, since the upper storage temperature is generally 85° C. The heat treatment process to eliminate unnecessary gas was carried out at 100° C. for 10 hours. The diffusion amount d at the waveguide due to heat diffusion at this time can be represented by d=2×[D(T)×t]1 / 2 (D: a diffusion constant and a function of T, T: a heat treatment temperature, and t: a heat treatment time).

Usually, the heat treatmen...

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Abstract

In a short-wavelength laser module, long-term reliability is lost because of unnecessary gas deposited on the end face of its optical waveguide.A short-wavelength laser module has a package structure wherein a package lid used when the short-wavelength laser module is hermetically sealed does not make contact with internal gas, and a process of accelerating the polymerization of a securing agent used inside the package is incorporated, whereby unnecessary gas from the securing agent is eliminated and the long-term reliability of the output is attained.

Description

TECHNICAL FIELDThe present invention relates to a short-wavelength laser module having a semiconductor laser housed in a package and outputting short-wavelength laser light and to a method of producing the laser module.BACKGROUND OF TECHNOLOGYIn the optical device field, the hermetic sealing structure and hermetic sealing method of each optical device are important technologies to attain the long-term reliability of the optical device, and also in an optical waveguide wavelength conversion device, the hermetic sealing structure has become a very important factor, since it is necessary to protect against external humidity and dust for stabilization of the characteristic of an optical waveguide itself, stabilization of the characteristic of an optical semiconductor, such as a semiconductor laser, and attainment of long-term reliability.In a hermetic sealing method in a conventional optical device, when a metallic package or a ceramic package is used in general, seam welding, such as r...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01S5/022H01S5/00G02F1/35G02F1/37
CPCH01S5/02216G02F1/37H01S5/0092H01S5/02248H01S5/0222H01S5/02325
Inventor MORIKAWA, AKIHIROKITAOKA, YASUOYAMAMOTO, KAZUHISATAKIGAWA, SHINICHI
Owner PANASONIC CORP
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