Component built-in wiring board

Abstract

A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority from Japanese Patent Application No. 2008-075169, filed on Mar. 24, 2008, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]Devices consistent with the present invention relate to a component built-in wiring board which includes a capacitor having an electrode layer and a dielectric layer.[0004]2. Related Art[0005]In recent years, a semiconductor integrated circuit device (an IC chip) to be used as a microprocessor of a computer has been enhanced in a speed and a function increasingly. Incidentally, there is a tendency that the number of terminals is increased and a pitch between the terminals is also reduced. In general, a large number of terminals are densely disposed in an array on a bottom surface of the IC chip, and the terminal group is connected to a terminal group on a mother board side by flip chip bonding. The pitch between ...

AI Technical Summary

Benefits of technology

[0008]Accordingly, it is an aspect of the present invention to provide a component built-in wiring board which can eliminate a drawback caused by an increase in a length of a wiring for connecting a component to a capacitor.

[0029]Furthermore, it is advantageous that a component mounting portion on which a surface mounting component is mounted should be set to a surface of the first built-up layer or a surface of the second built-up layer, the first component and the power terminal present in the component mounting portion should be electrically connected to each other through a power wiring provided in the first built-up layer or the second built-up layer, and the first component and the ground terminal present in the component mounting portion should be electrically connected to each other through a ground wiring provided in the first built-up layer or the second built-up layer. Consequently, it is possible to achieve the increase in the density of the component built-in wiring board by mounting the surface mounting component on the component mounting portion.

Problems solved by technology

For this reason, it is hard to directly connect the IC chip onto the mother board.

Therefore, it is hard to embed a capacitor in the core substrate.

Consequently, it is impossible to reliably reduce a switching noise of the IC chip by the capacitor and to surely stabilize a power voltage.

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