Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, high resin flowability resistance, and low specific resistance
a technology of gold alloy wire and bonding reliability, which is applied in the field can solve the problems of low short failure, and easy curling or meandering (curvature or bending) of gold alloy wire, and achieve excellent initial bonding ability, excellent bonding reliability, and excellent roundness of compression balls
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[0046]A gold alloy wire having a wire diameter: 19 μm was manufactured by a drawing process a gold alloy wire material having a wire diameter: 50 μm and having component compositions indicated in Tables 1 to 3 at a reduction ratio by one die of 4.8%. Further, gold alloy wires for a bonding wire according to the invention (hereinafter, referred to as wires according to the invention) 1 to 34, comparative gold alloy wires for a bonding wire (hereinafter, referred to as comparative wires) 1 to 20, and the related art gold alloy wire for a bonding wire (hereinafter, referred to as the related art wire) 1 were manufactured by annealing the gold alloy wire at temperature indicated in Tables 4 to 6, and taken-out by an immediate spool of radius: 50 mm. Here, in the annealing and winding process, the radii of all of sheaves (pulleys) using for changing paths of the wires are 9 mm. A fracture elongation percentage EL, Young's modulus (Pa) E, and 0.2% proof strength (Pa) σ0.2 were measured by...
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