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Paste for back contact-type solar cell

a solar cell and back contact technology, applied in the direction of sustainable manufacturing/processing, final product manufacturing, conductors, etc., can solve the problems of preventing low-cost production, time-consuming and complex production process, and lowering so as to improve efficiency and economic benefits, reduce the risk of reducing the power generation efficiency of the cell, and improve the effect of electrical characteristics

Inactive Publication Date: 2008-09-25
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0017]In addition, the paste of the present invention is able to form p-type electrodes having superior electrical characteristics by applying onto a p-type semiconductor and firing. Moreover, the electrodes can be formed by a thick film process, thereby enabling the electrodes to be formed economically. The use of low-temperature firing makes it possible to further enhance efficiency and economy.

Problems solved by technology

In the case of solar cells, however, high-temperature treatment results in the risk of lowering the power generation efficiency of the cell.
In addition, in the case of the application of thin films technique, the production process is time-consuming and complex, thereby preventing production from being carried out at low cost.
Since aluminum has an inferior adhesive strength as compared with solder, silver paste is used at those portions requiring soldering.

Method used

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  • Paste for back contact-type solar cell
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Examples

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Effect test

examples

[0068]Although the following provides an explanation of the present invention through examples thereof, the present invention is not limited to these examples.

(I) Preparation of Silver Pastes

[0069]Silver pastes 1 and 2 were produced to have the compositions shown in Table 1 using the materials indicated below.

[0070](i) Silver Particle

[0071]Flaked silver particle [d50 2.7 μm (as determined with a laser scattering-type particle size distribution measuring apparatus)

(ii) Glass Frit

[0072]Leaded: Lead borosilicate glass frit

[0073]Components: SiO2 / PbO / B2O3 / ZnO

[0074]Softening point: 440° C.

[0075]Lead-free: Lead-free bismuth glass frit

[0076]Components: SiO2 / Al2O3 / B2O3 / ZnO / Bi2O3 / SnO2

[0077]Softening point: 390° C.

(iii) Resin

[0078]Ethyl cellulose resin (Aqualon, Hercules)

(iv) Solvent

[0079]Terpineol

TABLE 1(Parts bySilverGlass fritweight)particleLeadedLead-freeResinSolventTotalPaste 170.305.252.5021.95100.00Paste 270.305.252.5021.95100.00

[0080]The silver particle, glass frit, resin and solvent ...

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Abstract

Disclosed is a paste for a back contact-type solar cell that includes: (a) electrically conductive particles containing silver particle and added particles selected from the group consisting of (i) metal particles selected from the group consisting of Mo, Tc, Ru, Rh, Pd, W, Re, Os, Ir and Pt particles, (ii) a metal alloy containing the metal particles, and (iii) particles loaded with the metal particles, (b) glass frit, and (c) a resin binder.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a paste for a solar cell, and more particularly, to an electrically conductive paste used to form electrodes of a back contact-type solar cell.[0003]2. Technical Background[0004]Silver paste is widely used for the electrode paste used in solar cells, since electrode pastes for solar cells are required to have low electrical resistance to facilitate improved efficiency. In the case of contact between a metal and semiconductor, a Schottky barrier is known to be formed that causes a considerable increase in contact resistance. This type of contact is referred to as Schottky contact. Since the electrical resistance of an electrode is the sum of the conductor resistance and contact resistance, in addition to lowering the conductor resistance of an electrode paste, it is also necessary to reduce the contact resistance with the conductor. The ideal contact of an electrode material, free of a Sc...

Claims

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Application Information

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IPC IPC(8): H01L31/0224H01B1/02
CPCC03C8/04C03C8/10C03C8/18C03C14/006C03C2214/08Y02E10/547H01B1/22H01L31/022433H01L31/022441H01L31/03529H01L31/1804C03C2214/16Y02P70/50
Inventor AKIMOTO, HIDEKI
Owner EI DU PONT DE NEMOURS & CO
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