Systems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene

Abstract

Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. In one embodiment, the vapor compression refrigeration system includes a condenser, at least one expansion structure, at least one evaporator, and a compressor coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component. At least a portion of the at least one expansion structure is coated with a polytetrafluorethylene in the refrigerant flow path for inhibiting accumulation of material thereon. The polytetrafluorethylene coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area.

Description

TECHNICAL FIELD [0001] The present invention relates generally to heat transfer mechanisms, and more particularly, to cooling systems and methods for removing heat generated by one or more heat generating electronics components. More particularly, the present invention relates to cooling systems and methods employing vapor compression refrigeration. BACKGROUND OF THE INVENTION [0002] As is known, operating electronic devices produce heat. This heat should be removed from the devices in order to maintain device junction temperatures within desirable limits. Failure to remove produced heat results in increased device temperatures, potentially leading to thermal runaway conditions. Several trends in the electronics industry have combined to increase the importance of thermal management, including heat removal for electronics devices, particularly in technologies where thermal management has traditionally been less of a concern, such as CMOS. In particular, the need for faster and more ...

AI Technical Summary

Benefits of technology

[0006] The shortcomings of the prior art and additional advantages are provided through the provision of a cooling system for cooling at least one heat generating electronics component. The cooling system includes a vapor compression refrigeration system. The vapor compression refrigeration system has a condenser, at least one expansion structure, at least one evaporator and a compressor all coupled in fluid communication to define a refrigerant flow path and allow the flow of refrigerant therethrough. The at least one evaporator facilitates removal of heat produced by the at least one heat generating electronics component, while at least a portion of the at least one expansion structure is coated with a polytetrafluorethylene in the refrigerant flow path. The polytetrafluorethylene coating inhibits accumulation of material on selected pressure drop surfaces of the at least one expansion structure.

[0007] In another embodiment, a vapor compression refrigeration cooling system is provided for cooling at least one heat generating electronics component. This cooling system includes: a condenser, a first electrically controlled expansion valve coupled to the condenser, a first evaporator coupled to the first electrically controlled expansion valve; a second electrically controlled expansion valve coupled to the condenser, a second evaporator coupled to the second electrically controlled expansion valve; a controller providing control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve; and a compressor coupled to the first evaporator, the second evaporator and the condenser. The condenser, the first electrically controlled expansion valve, the first evaporator, the second electrically controlled expansion valve, the second evaporator, and the compressor are coupled in fluid communication to define multiple refrigerant flow paths, each refrigerant flow path allowing flow of refrigerant therethrough. The first evaporator and the second evaporator facilitate removal of heat produced by the at least one heat generating electronics component. At least a portion of the first electrically controlled expansion valve and at least a portion of the second electrically controlled expansion valve are coated with a polytetrafluorethylene in the respective refrigerant flow paths for inhibiting accumulation of material thereon.

Problems solved by technology

This amassing of material can interfere with the normal control volumes and interfere with the control of motor steps (due to unpredictable valve characteristic changes).

This is particularly true when the vapor compression refrigeration system is employed in a cooling application for removing heat from a heat generating electronics component as described herein since control of the valve in this environment is a very sensitive application and expansion structure geometries are typically very small.

To eliminate all contaminants from the vapor compression refrigeration system would be too costly, if not impossible.

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