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Ureaformaldehyde resin coating epoxy microcapsule for material self-repair and preparing method thereof

A urea-formaldehyde resin and self-repairing technology, which is applied in the direction of microcapsule preparation, microsphere preparation, etc., can solve the problems of unsuitability, low mechanical properties, and expensive catalysts, etc., and achieve extended service life, high mechanical properties, and reduced production costs Effect

Inactive Publication Date: 2007-03-14
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the repair agent using DCPD as a self-repairing composite material has the following disadvantages: the catalyst used to catalyze the polymerization reaction of DCPD is expensive; the mechanical properties of the polymerization reaction product of dicyclopentadiene are low; two isomers with freezing points of 33°C and 19.5°C, respectively, so dicyclopentadiene is not suitable for self-healing of composites used at low temperatures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Add 12g of urea and 24g of 37% formaldehyde solution into a 250ml three-necked reaction flask equipped with mechanical stirring. After the urea is completely dissolved, use triethanolamine to slowly adjust the pH value of the solution to about 8, and then heat it up at a heating rate of 5°C / min. The temperature of the reaction system is raised to 50-65° C. and kept for 1 hour to obtain a prepolymer of urea formaldehyde. After the product was naturally cooled, 100 g of 1% DBS aqueous solution was added. After mixing 10g of bisphenol A type epoxy resin (E-51) and 10g of monoepoxy reactive diluent butyl glycidyl ether, slowly add to the above solution, set the speed at 350rpm, and start to use 10% after 20-30min H 2 SO 4 The solution slowly adjusts the pH value of the reaction system to about 2-3, raises the temperature of the reaction system to 60-65°C at a heating rate of 2°C / min, maintains the reaction temperature for 3-4h, and the reaction ends. Wash the reacted sys...

Embodiment 2

[0033] Add 12g of urea and 24g of 37% formaldehyde solution into a 250ml three-necked reaction flask equipped with mechanical stirring. After the urea is completely dissolved, use triethanolamine to slowly adjust the pH value of the solution to about 8, and then heat it up at a heating rate of 5°C / min. The temperature of the reaction system is raised to 60-65° C. and kept for 1 hour to obtain a prepolymer of urea formaldehyde. After the product was naturally cooled, 100 g of 1% DBS aqueous solution was added. Mix 10g of bisphenol A type epoxy resin (E-51) with 15g of monoepoxy active diluent phenyl glycidyl ether, slowly add to the above solution, set the speed at 350rpm, start to use 10% after 20-30min H 2 SO 4 The solution slowly adjusts the pH value of the reaction system to about 2-3, raises the temperature of the reaction system to 60-65°C at a heating rate of 2°C / min, maintains the reaction temperature for 3-4h, and the reaction ends. Wash the reacted system with deio...

Embodiment 3

[0035] Add 12g of urea and 24g of 37% formaldehyde solution into a 250ml three-necked reaction flask equipped with mechanical stirring. After the urea is completely dissolved, use triethanolamine to slowly adjust the pH value of the solution to about 8, and then heat it up at a heating rate of 5°C / min. The temperature of the reaction system is raised to 60-65° C. and kept for 1 hour to obtain a prepolymer of urea formaldehyde. After the product was naturally cooled, 100 g of 1% DBS aqueous solution was added. After mixing 10g of epoxy resin (E-51) and 15g of monoepoxy reactive diluent propylene glycidyl ether, slowly add it to the above solution, set the speed at 350rpm, and start to use 10% H 2 SO 4 The solution slowly adjusts the pH value of the reaction system to about 2-3, raises the temperature of the reaction system to 60-65°C at a heating rate of 2°C / min, maintains the reaction temperature for 3-4h, and the reaction ends. Wash the reacted system with deionized water a...

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PUM

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Abstract

The invention relates to an ureaformaldehyde resin packed epoxy microcapsule used to recover the material. Wherein, the invention is characterized in that: it comprises aquacare, formaldehyde solution, epoxy resin, epoxy active diluent, water, emulsifier and defoaming agent. And the production comprises mixing formaldehyde and aquacare in boiling flask; when the aquacare is dissolved, adjusting pH and increasing temperature, controlling the reaction temperature and time, to obtain the pre-polymerized element of formaldehyde; when it is cooled, adding the water solutin with emulsifier and defoaming agent; adding epoxy resin and active diluent, to be mixed to obtain acid adjusting solution, increasing temperature and ending reaction; washing the product with water and acetone solution, filtering and drying to obtain white microcapsule. The invention has low cost and wide application, to prolong the service life of compound.

Description

Technical field: [0001] The invention relates to a urea-formaldehyde resin-coated epoxy microcapsule for self-repair of materials and a preparation method thereof. A series of different temperature-resistant ( -10~260℃) and pressure (0.2~2.0μN), microcapsules with good sealing performance and stability. Background technique: [0002] Since the early 1950s, NCR Corporation of the United States first used microcapsule technology to prepare carbon paper, and microcapsules have been widely used. Microcapsules have expanded from the initial drug coating to food, pesticides, feed, coatings, inks, adhesives, Cosmetics, detergents, photosensitive materials, textiles and other industries. In recent years, the application of microcapsules in the self-healing of composite materials has become a new focus. This idea is based on the principle that biological systems can heal automatically after damage. When the microcapsule is cracked under the action of crack stress, the capsule core ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/02C08J7/00C08L63/00C08G12/12
Inventor 梁国正袁莉李岚马晓燕郭敬谢建强
Owner NORTHWESTERN POLYTECHNICAL UNIV
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