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Conductive fine particle and anisotropic conductive material

A technology of conductivity and conductive film, which is applied in the direction of conductive connection, metal material coating process, printed circuit assembly of electric components, etc. , conductivity deterioration and other problems, to achieve the effect of excellent conductivity reliability, small deviation, and excellent adhesion

Active Publication Date: 2007-01-31
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this manufacturing method, it is extremely difficult to control the size, shape, and amount of tiny nickel particles forming the protrusions, and therefore, it is extremely difficult to control the number, size, and shape of the protrusions obtained.
In addition, since the microprotrusions are precipitated and formed in the plating process using a nickel plating solution containing a large amount of phosphorus, there is a disadvantage that the conductivity deteriorates due to the large amount of phosphorus contained.

Method used

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  • Conductive fine particle and anisotropic conductive material
  • Conductive fine particle and anisotropic conductive material
  • Conductive fine particle and anisotropic conductive material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] (Pretreatment process for electroless plating)

[0116] Alkaline degreasing with aqueous sodium hydroxide solution, acid neutralization, and tin dichloride solution were performed on 10 g of base material particles composed of a copolymer resin of tetramethylolmethane tetraacrylate and divinylbenzene with an average particle diameter of 3 μm. photosensitive treatment. Thereafter, electroless plating pretreatment in which activation was performed in a tin dichloride solution was performed, and after filtration and washing, substrate fine particles having palladium adhered to the particle surface were obtained.

[0117] (Core material compounding process)

[0118] The obtained matrix fine particles were stirred in 300 ml of deionized water for 3 minutes to disperse them. Then, 1 g of metal nickel particle cement ("2020SUS" manufactured by Mitsui Kinzoku Co., Ltd., average particle diameter: 200 nm) was added to the aqueous solution over 3 minutes to obtain substrate fin...

Embodiment 2

[0128] In addition to using metal nickel particle paste ("2007SUS" manufactured by Mitsui Kinzoku Co., Ltd., average particle size 50nm) in the core material compounding process instead of metal nickel particle paste ("2020SUS" manufactured by Mitsui Kinzoku Corporation, average particle size 200nm), Nickel-plated conductive fine particles were obtained in the same manner as in Example 1.

[0129] Then, gold plating was performed on the surface by a displacement plating method to obtain gold-plated conductive fine particles.

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Abstract

The present invention relates to conductive fine particles having low connection resistance, small variation in particle conductive performance, and excellent conduction reliability, and an anisotropic conductive material using the conductive fine particles. Anisotropic conductive materials using conductive fine particles are sandwiched between opposing substrates or electrode terminals in electronic devices such as mobile phones. However, with the development of electronic devices in recent years, the use of anisotropic conductive materials is sought Improvement of conductivity reliability of conductive fine particles, etc. The present invention seeks to improve the reliability of conduction by using, as the conductive fine particles used in the anisotropic conductive material, etc., the conductive fine particles in which the surface (2) of the base material fine particles is covered with a conductive film (4 ), (5) coating, and having a plurality of protrusions (5b) protruding from the surface of the conductive film (1), is characterized in that the surface of the matrix particle has a surface that makes the surface of the conductive film protrude The core material (3) is composed of a conductive material different from the conductive material constituting the conductive film.

Description

technical field [0001] The present invention relates to conductive fine particles having a low connection resistance value, small variation in particle conductive performance, and excellent conduction reliability, and an anisotropic conductive material using the conductive fine particles. Background technique [0002] Conductive fine particles are widely used in, for example, anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive adhesive, anisotropic conductive film, Anisotropic conductive materials such as anisotropic conductive sheets. [0003] These anisotropic conductive materials are sandwiched between opposing substrates or electrodes in electronic devices such as liquid crystal displays, personal computers, and mobile phones to electrically connect substrates, or to electrically connect small components such as semiconductor elements to substrates. used between terminals. [0004] As the conductive fine particles used in the above-mentione...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00H01B5/16H01R11/01B22F1/18C23C18/16H01R13/03H05K3/32
CPCC23C18/1641B22F2999/00H05K2201/0272H01R13/03C23C18/1635B22F1/025C23C18/30H05K2201/0218H05K3/323Y10T428/24612Y10T428/2991Y10T428/12181B22F1/18C23C18/16H01B5/00
Inventor 石田浩也胁屋武司上野山伸也
Owner SEKISUI CHEM CO LTD
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