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Method for preparing high temperature resistant phenol-formaldehyde foam composite thermal-insulating materials

A composite thermal insulation material and phenolic foam technology, which is applied in the field of preparation of high temperature-resistant phenolic foam composite thermal insulation materials, can solve problems such as unsafe thermal insulation building materials, achieve high thermal insulation effect, excellent thermal insulation performance, and improve the effect of heat resistance grade.

Inactive Publication Date: 2006-10-11
上海胜星树脂涂料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, PU and PS foams are flammable and are very unsafe as insulation building materials. In recent years, their market applications have been greatly restricted.

Method used

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  • Method for preparing high temperature resistant phenol-formaldehyde foam composite thermal-insulating materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Add 4500g resole phenolic resin, 180g sorbitan oleate polyoxyethylene ether, trade name Tween-80, 22g boron trioxide, 1000g aluminum hydroxide, 400g pentane and 630g mixed acid curing agent into the mixing pot in sequence , stir at high speed for 15 seconds, quickly and evenly pour 100 to pay 0.06m 3 In the plate mold or pipe mold, lay a 3mm thick glass fiber felt, close the mold, foam and solidify at 60°C for 1 hour, cool, demould, and the density is 100kg / m 3 Left and right high temperature resistant phenolic foam composite insulation materials.

Embodiment 2

[0040] Add 4500g resole phenolic resin, 75g Tween-80, 60g boron powder, 3000g aluminum hydroxide, 650g pentane and 400g mixed acid curing agent into the mixing pot in turn, stir at high speed for 40 seconds, quickly and evenly pour 250 to 0.06m 3 In the plate mold or pipe mold, spread 10mm thick ceramic fiber felt, close the mold, foam and solidify at 85°C for 45min, cool, demould, and the density is 50kg / m 3 Left and right high temperature resistant phenolic foam composite insulation materials.

Embodiment 3

[0042] Add 4500g resole phenolic resin, 350g Tween-80, 450g zinc borate, 1500g aluminum hydroxide, 500g pentane and 600g mixed acid curing agent into the mixing pot in turn, stir at high speed for 15 seconds, quickly and evenly pour 200 to 0.06m 3In the plate mold or pipe mold, lay 6mm thick mineral wool felt, close the mold, foam and solidify at 70°C for 1.5 hours, cool, demould, and the density is 40kg / m 3 Left and right high temperature resistant phenolic foam composite insulation materials.

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PUM

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Abstract

The invention relates to a method for preparation of refractory phenolic cellular syntactic insulant, which consists of adding aluminum hydroxide, pantane and mixed acid curing agent into bakelite A, which is characterized in that: a) adding boride into bakelite A as well, then the boride performing coordination with the bakelite A to produce boron-modified alkyd resin at the indoor temperature; b) selecting inorganic heat-insulating material with thickness of 1-50mm as backing strip, pouring boron-modified alkyd resin onto the backing strip to foam and solidificate with a temperature of 40-90 DEG C for 0.5-1.5 hours, then cooling and demoulding. The invention can resist a high temperature of 250 DEG C and can be used between -190 DEG C and +250 DEG C, which has both champion heat-retaining performance of the phenolic foam plastic and fire resistance of the inorganic heat-insulating material, and has a light weight and is hard to burn, so can be widely used in heat-insulating space.

Description

1. Technical field: [0001] The invention relates to a method for preparing an insulating material, in particular to a method for preparing a high-temperature-resistant phenolic foam composite insulating material. It modifies phenolic resin, and then compound it with inorganic thermal insulation materials. While maintaining its original advantages, it prepares a high temperature resistant phenolic foam composite thermal insulation material, which can be widely used in thermal insulation places of -190~+250℃. 2. Background technology: [0002] The energy problem is a problem that countries all over the world pay attention to at present, and it is listed as one of the four major survival problems faced by human beings. In the world's energy consumption, since the proportion of building energy consumption is very high (generally 20% to 40%), all countries in the world have listed building energy conservation as the focus of energy conservation work. According to statistics, my ...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08K3/22C08K3/38
Inventor 黄剑清王琪生
Owner 上海胜星树脂涂料有限公司
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