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Method for raising heat-resistance property of organic silicon resin adopting polyheadral oligo-sesqui silione

A technology of polysilsesquioxane and silicone, which is applied in the field of improving the heat resistance of silicone resin, can solve the problems of reducing the wave transmittance of silicone resin, etc., to reduce the dielectric constant, improve heat resistance, and improve phase capacitive effect

Active Publication Date: 2005-12-21
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods can improve the heat resistance of the silicone resin to a certain extent, but because the introduction of phenyl-containing compounds or metal oxides reduces the wave transmittance of the silicone resin (at a frequency of 10 GHz and a temperature of 20 ° C , the dielectric constant of silicone resin is 2.8~2.9)

Method used

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specific Embodiment approach 1

[0005] Specific embodiment one: the method for improving the heat resistance of silicone resin by using polyhedral oligomeric silsesquioxane in this embodiment is completed by the following steps: a, using methyl alkoxysilane monomer as raw material, through hydrolysis and polycondensation reaction to obtain a silicone resin; b, adding an alcohol solvent to the silicone resin made in step a, to make a silicone resin with alcohols as a solvent with a mass percentage of 30% to 50%; c, adding Polyhedral oligomeric silsesquioxane is added to the silicone resin prepared in step b, the amount of polyhedral oligomeric silsesquioxane is 0.5-10% of the mass of the silicone resin, and the reaction temperature is 60-90°C. The reaction time is 4-8 hours, and then vacuum distillation is carried out at a temperature of 50-80° C. and a system vacuum of 9-11 mmHg to distill off alcohol solvents and water to prepare silicone resin.

specific Embodiment approach 2

[0006] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the addition of polyhedral oligomeric silsesquioxane in step c of this embodiment accounts for 0.6% of the mass of the silicone resin, and the reaction temperature is 65 °C, the reaction time is 4.5h, and after the reaction is completed, vacuum distillation is carried out under the condition that the temperature is between 50°C and 80°C and the system vacuum is 9mmHg. The silicone resin with high temperature resistance can be made by adopting the above technical parameters.

specific Embodiment approach 3

[0007] Specific embodiment three: the difference between this embodiment and specific embodiment one is: the addition of polyhedral oligomeric silsesquioxane in the c step of this embodiment accounts for 9.5% of the quality of the silicone resin, and the reaction temperature is 85 °C, and the reaction time is 7.5 hours. After the reaction is completed, vacuum distillation is carried out at a temperature of 50-80 °C and a system vacuum of 11 mmHg. Using the above technical parameters can produce silicone resin with better high temperature resistance.

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Abstract

This is the method of improving the thermal stability of organosilicon resin adopting polyhedral oligomeric silsesquioxane (POSS). It relates to a kind of method of improving the thermal stability of organosilicon resin. The invention solves the problem of reducing the wave-transmissivity of the organosilicon resin by all the methods that changes the structure of the pendent groups of polysiloxane or changes the structure of main chain or adds thermostable padding to improve the thermal stability of the organosilicon resin. It includes following steps: a. adopt methyl methoxy silane monomer as raw material, prepare organosilicon resin through hydrolyzation and polyesterification reaction; b. add alcohol solvent into the prepared organosilicon resin to prepare the organosilicon resin with alcohol as solvent; besides it also includes Step c.: add 0.5 -10% POSS of the weight of the organosilicon resin into the organosilicon resin produced in Step b., the reaction temperature is 60 -90 Deg. C, the reaction time is 4 -8 hours, and vacuum membrane distillation. The modified organosilicon resin produced by the method has high heat-resisting performance.

Description

Technical field: [0001] The invention relates to a method for improving the heat resistance of silicone resin, in particular to a method for improving the heat resistance of silicone resin by using polyhedral oligomeric silsesquioxane. Background technique: [0002] With the development of aerospace technology and the needs of modern warfare, the flight Mach number of aerospace vehicles continues to increase, and the radome at the maximum aerodynamic heating position of the aircraft needs to withstand higher and higher temperatures and thermal shocks. For aerospace wave-transparent materials The high temperature resistance puts forward higher and more urgent requirements, which is more closely dependent on the research and development of high temperature resistant wave-transparent resin matrix. Therefore, improving the heat resistance of the resin matrix has become a priority development direction of aerospace wave-transparent materials. The resin matrix of early aerospace ...

Claims

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Application Information

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IPC IPC(8): C08G77/38
Inventor 黄玉东刘玉荣刘丽胡立江刘立询
Owner HARBIN INST OF TECH
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