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Lead-free electroplated silver slurry for outer electrode of multilayer chip element

A multi-layer chip, external electrode technology, applied in the field of external electrodes, can solve problems such as heavy metal lead pollution, and achieve the effects of avoiding pollution, good leveling, and compact structure

Inactive Publication Date: 2005-09-28
贵州振华亚太高新电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a new type of lead-free electroplatable silver paste for external electrodes of multi-layer chip components, so as to overcome the shortcoming that the heavy metal lead in the existing external electrode pastes pollutes the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: the lead-free glass frit in the electroplatable silver paste that the external electrode of multi-layer chip type component is lead-free, it is made of Bi 2 o 3 , SiO 2 , B 2 o 3 , ZnO, Al 2 o 3 , CaO composition, its weight percentage is: Bi 2 o 3 40%, SiO 2 10%, B 2 o 3 15%, ZnO15%, Al 2 o 3 10%, CaO10%; use the known technology, use the corresponding oxides or other substances to melt at 1200-1400 ℃, after grinding, the melting temperature is T g =810°C lead-free glass powder.

Embodiment 2

[0012] Embodiment 2: multilayer chip inductor and multilayer chip thermistor (NTC) external electrodes are lead-free electroplateable silver paste, and it is made of organic carrier 21.5%, lead-free glass powder 5%, Bi 2 o 3 3%, leveling and anti-sagging agent stearic acid 0.5%, silver micropowder 42%, flake silver powder 28% mixed; the organic carrier is made of ethyl cellulose 13%, solvent butyl carbitol 80% %, plasticizer dibutyl phthalate 5%, dispersant peanut oil 2%; the preparation method is to batch and mix each component, and obtain the finished product after rolling and passing the test.

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Abstract

The lead-free electroplated silver slurry for outer electrode of multilayer chip element consists of organic carrier, lead-free glass powder, Bi2O3, leveling agent, fine silver powder, flake silver powder, etc. The silver slurry is suitable for use in producing outer electrodes for multilayer chip inductor and multilayer chip thermistor, and has the features of excellent device matrix matching performance, excellent leveling property, high thixotropy resistance and environment pollution caused by lead.

Description

technical field [0001] The invention relates to external electrodes of resistors and inductors, in particular to a lead-free electroplatable silver paste for the external electrodes of multilayer chip thermistors (NTC) and multilayer chip inductors. Background technique [0002] Chip components are a concrete manifestation of the development of electronic components towards miniaturization, compounding, light weight, multi-function, high reliability, and long life. They are born and developed in response to increasing assembly density, reducing size, reducing weight, and improving performance of electronic products. In order to solve the problems existing in the practical application of chip components, surface mount technology came into being. The chip element is composed of a substrate, a metal film electrode and an external electrode. Most of the traditional external electrode pastes are thick-film pastes composed of a lead-containing glass frit m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/064C03C8/18C03C8/24H01L23/10
CPCC03C8/18
Inventor 杨锐昌陈群星张力平
Owner 贵州振华亚太高新电子材料有限公司
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