Chip module with high radiating performance and its substrate

Abstract

The chip module consists of a high thermal diffusivity base board, at least one chip mounted on base board. The high thermal diffusivity base board is made by forming insulation layer on metal compound material sheet and then mounting copper wire layer on the insulation layer. The copper wire layer can be used in adhering chip. For the material of base board, the aluminum base with high coefficient of heat-transfer is selected.

Description

technical field [0001] The invention relates to a high heat dissipation chip module and its substrate, in particular to a laminated circuit board in which the chip module uses an aluminum-based composite material to form a metal composite plate. Background technique [0002] With the gradual development of electronic products in the direction of high performance, high frequency, high speed and thinness, under the design concept of light, thin, short, small and multifunctional, various electronic related main components such as central processing unit ( CPU), chipset (Chipset), etc. are all researched and developed in the direction of high speed, multi-function, high power, and small size. Therefore, the calorific value per unit volume in the components is constantly increasing, and the heat dissipation of the components has become the key to the continued development of the electronics industry. [0003] The performance of integrated circuit (IC) chips continues to improve ...

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of ordinary glass fiber cloth or soft substrate is not good, so the components on the printed circuit board need to use air as the heat conduction medium

However, heat dissipation by air conduction cannot quickly and effectively dissipate the accumulated heat of components, which reduces the performance of components and even reduces the life of components. This situation is more serious in multilayer circuit boards.

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