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Method for preparing flexible copper-cladded plate

A copper-clad laminate and winding technology, which is applied in the preparation field of winding copper-clad laminates, can solve the problems of poor surface appearance and high peel strength, and achieve the effects of low production cost, good flexibility and stable performance

Active Publication Date: 2005-02-16
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of electronic information technology and the improvement of people's living standards, household appliances, mobile phones, computers, medical equipment, military facilities and instruments have higher and higher requirements for printed circuit board materials. More and more sophisticated, the original multi-layer and thicker printed circuit boards are no longer suitable for the needs of current electronic products. At present, Japan uses copper foil to coat polyimide film. The peeling strength between the sheets is high, and it can only be used as a single-sided printed circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1, polyimide film copper plating, method is as follows:

[0012] (1) Substrate: polyimide film, thickness 0.025mm;

[0013] (2) Vacuum copper plating: Copper sputtering polyimide film in a vacuum chamber, temperature 116 ° C, vacuum degree 2.5 × 10 -3 Pa, polyimide film moving speed 1.2m / min, metal ion sputtering concentration 1.5g / m 2 , at this time, the surface resistance of the material is 500Ω / cm~600Ω / cm;

[0014] (3) Then adopt the existing plastic electroplating technology to continuously plate copper on the above-mentioned materials, so that the surface resistance reaches the technical requirements;

[0015] The above materials are rinsed, dried and rolled.

Embodiment 2

[0016] Embodiment 2, nickel-plated polyester film adds silver, and method is as follows:

[0017] (1) Substrate: polyethylene terephthalate film (PET), thickness 0.018mm;

[0018] (2) Vacuum nickel plating: The polyester film is sputtered with nickel in a vacuum chamber at a temperature of 160°C and a vacuum of 2.5×10 -3 Pa, polyester film moving speed 2m / min, surface resistance 40Ω / cm~50Ω / cm;

[0019] (3) Then adopt the existing plastic electroplating technology to continuously plate silver on the above-mentioned materials, so that the surface resistance meets the technical requirements.

[0020] The above materials are washed, dried and rolled.

Embodiment 3

[0021] Embodiment 3, nickel-plated polypropylene film adds copper, and method is as follows:

[0022] (1) Substrate: polypropylene film, thickness 0.02mm;

[0023] (2) Vacuum nickel plating: The polypropylene film is sputtered with nickel in a vacuum chamber at a temperature of 165°C and a vacuum of 2.5×10 -3 Pa polypropylene film moving speed 2m / min, surface resistance 40Ω / cm~-50Ω / cm;

[0024] (3) Then use the existing plastic electroplating technology to continuously plate copper on the above-mentioned materials to make the surface resistance meet the technical requirements. The surface resistance of the material is R=0.001Ω / cm˜0.1Ω / cm.

[0025] The above materials are washed, dried and rolled.

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PUM

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Abstract

The invention discloses a produce method of reel cover copper board, including vacuum plating copper, nickel, gold, silver on the polyurethane film, polyester film, polypropylene film base body, then continue complex plating copper and other metal. This invention has the following excellence compared to the nowadays technology: (1) compare to current cover copper board it is more light, the electronic conduction layer can be more slim, the soft character can be better, it is more suitable to the modern electronic technology development. It is suitable to hand phone, POP-TV, LCD-TV and so on. (2) the thickness is average, the bond is not necessary, the combination has no air bladder, the function is more stable. (4) no pollution, and low produce cost.

Description

(1) Technical field: [0001] The invention relates to a method for preparing a coiled copper-clad laminate, which belongs to the technical field of vacuum plating and electroplating. (2) Technical background: [0002] With the rapid development of electronic information technology and the improvement of people's living standards, household appliances, mobile phones, computers, medical equipment, military facilities and instruments have higher and higher requirements for printed circuit board materials. More and more sophisticated, the original multi-layer and thicker printed circuit boards are no longer suitable for the needs of current electronic products. At present, Japan uses copper foil to coat polyimide film. The peel strength between the sheets is high, and it can only be used as a single-sided printed circuit board. (3) Contents of the invention: [0003] Aiming at the defects of the prior art, the present invention provides a method for preparing a flexible copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C23C28/02H05K1/05
Inventor 夏登峰夏祥华贾富德夏芝林夏登收夏登宇夏海军董贯斌
Owner TIANNUO PHOTOELECTRIC MATERIAL
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