Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Magnetically controlled sputtering process of making printed circuit board

A printed circuit board, magnetron sputtering technology, applied in the direction of printed circuit, printed circuit manufacturing, and the formation of electrical connection of printed components, can solve problems such as connection conduction, improve efficiency, reduce pollution, and avoid uneven coating. Effect

Inactive Publication Date: 2004-09-08
曹波 +2
View PDF1 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a method for making circuit boards by magnetron sputtering, which solves the problem of connection and conduction between layers and interlayer holes in the process of making circuit boards by magnetron sputtering, making it suitable for large-scale Production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Magnetically controlled sputtering process of making printed circuit board
  • Magnetically controlled sputtering process of making printed circuit board
  • Magnetically controlled sputtering process of making printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0019] Specific embodiment one: make multi-layer printed circuit board, adopt whole board electroplating technology, its production process is as follows figure 2 Shown:

[0020] 1) Drilling: After cleaning the board to be operated, drill through holes on the board to be operated according to the design requirements of the circuit board.

[0021] 2) After the drilled plate is cleaned, chromium, nickel and nickel-copper alloy are sequentially sputtered on the surface of one side or both sides of the plate and the inner wall of the hole to improve the affinity between the copper foil and the substrate , the sputtering time is set to 0.1-5min according to the thickness of the coating, the sputtering current should not be too small to avoid low efficiency, it is set to 0.1-5A, the sputtering gas pressure is -3 to 3×10 -3 torr;

[0022]3) Sputter a conductive copper layer of 0.1-5 μm on the surface of one side or both sides of the plate to be operated and the dielectric layer me...

specific Embodiment 2

[0037] Specific embodiment two: make double-sided printed circuit board, use graphic electroplating technology, its production process is as follows figure 2 Shown:

[0038] 1) Drilling: After cleaning the board to be operated, drill through holes on the board to be operated according to the design requirements of the circuit board.

[0039] 2) Clean the single-layer substrate after drilling, and magnetron sputtering on the surface of one side or both sides and the inner wall of the hole to improve the affinity between the copper foil and the substrate. The underlying dielectric metal layer, technical and process requirements With embodiment one;

[0040] 3) Magnetron sputtering a conductive copper layer on the surface of one side or both sides of the single-layer substrate and the dielectric layer metal on the inner wall of the hole, the technical and process requirements are the same as those in Embodiment 1;

[0041] 4) Line graphics production. Paste the photosensitive...

specific Embodiment 3

[0049] Specific embodiment three: make multi-layer printed circuit board, circuit forming uses floating technology, and its production process is as follows Figure 4 Shown:

[0050] 1) Drilling: After cleaning the substrate board to be operated, drill holes on the board to be operated according to the design requirements of the circuit board;

[0051] 2) Clean the substrate.

[0052] 3) Making a negative image of the circuit: coating or pasting a layer of photosensitive material on the surface of the substrate, exposing and developing the substrate on a photolithography machine, cleaning the surface of the substrate to obtain a negative image of the circuit coated with photosensitive material, and then drying ;

[0053] 4) Sputtering medium layer: After the drilled plate is cleaned, three metals such as chromium, nickel and nickel-copper alloy are sequentially sputtered on the surface of one side or both sides of the plate and the inner wall of the hole. Adhesive layer, te...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Peel strengthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides one kind of magnetically controlled sputtering process of making printed circuit board. The process includes the following steps: drilling holes on the single layer base material; magnetically controlled sputtering the bottom dielectric and metal layer on the drilled single layer base material; magnetically controlled sputtering conducting copper layer on the single layer base material; drilling holes on multilayer board; magnetically controlled sputtering bottom dielectric and metal layer on the drilled multilayer board; magnetically controlled sputtering conducting copper layer on the drilled multilayer board; and repeating the foregoing steps until reaching the required layer number of the printed circuit board. The present invention combines unique hole forming method and sputtering method and has raised copper-plating and hole-metallizing efficiency, raised reliability and high fine circuit making capacity.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a process method for manufacturing a printed circuit board by using a magnetron sputtering method. Background technique [0002] With the miniaturization, high-speed and digitalization of electronic products, PCB products must also develop in the direction of ultra-thin, high-density and miniaturization. High density refers to increasing the component loading and wiring density per unit area of ​​printed circuit boards. The measures taken are thin lines, small holes and multiple layers of circuit boards. The width and spacing of wires tend to be less than 0.1mm (such as 3mil line width and line spacing), and the via hole diameter is less than φ0.2mm. Multilayer boards with more than 10 layers will be used in large quantities, and there will be a large number of blind holes and buried holes, and hole metallization Etching and etching are two key steps in the p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/16H05K3/42H05K3/46
Inventor 曹波赵平喜郝建平
Owner 曹波
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com