Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device

Abstract

Quality control of product manufacturing is performed with a simple structure and, in addition, damage of a product when a production line is stopped is avoided. A preheating block approaches a circuit substrate having a predetermined length along a tape substrate from a predetermined position by gradual upward movements to carry out preheating and is then returned to the predetermined position, a main heating block arranged close to the preheating block is made to contact the circuit substrate on which the preheating has been carried out and which is transported in a predetermined tact to apply peak heating and is then restored to the predetermined position, and a cooling block accesses the circuit substrate to which the peak heating has been applied to cool the circuit substrate and is then returned to the predetermined position.

Description

technical field [0001] The invention relates to an electronic device manufacturing device, a manufacturing method of the electronic device and a manufacturing program of the electronic device, and is especially suitable for the solder reflow soldering process of a carrier tape substrate installed with electronic components. Background technique [0002] In semiconductor manufacturing equipment, there is a process of bonding a semiconductor chip by, for example, reflow soldering in a COF (Chip On Film) module and a TAP (Tape Automated Bonding) module. [0003] Figure 17 A prior art method of manufacturing an electronic device is shown. [0004] exist Figure 17 Among them, in the reflow soldering process, heater sections 811 to 813 and a cooling section 814 are provided along the conveying direction of the right arrow of the tape carrier substrate 801 . Here, in the reflow soldering process, if rapid high-temperature heating is performed, reflow cracks may occur in the conn...

AI Technical Summary

Problems solved by technology

Then, when the line is stopped for a certain period of time or longer, it is difficult to avoid damage to the product because the product under heat treatment cannot be retracted.

[0010] In addition, since the heat is also transferred to the next carrier substrate 801 to be heat-treated before the heater section 811, it is difficult to perform product quality control.

[0011] In addition, when the assembly line recovers from a stop, preheating, peak heating, and cooling are performed again. Since the damaged product part needs to be sent out of the reflow soldering process, the switch of the heat source of the machine is turned on, so there is a delay after recovery. The problem of increased waiting time for normal operation of heat treatment and cooling treatment

[0012] In addition, in the cooling zone 814 of the reflow soldering process, due to the use of low-temperature air cooling, the cooling treatment time is increased, especially for lead-free solder paste, it is very difficult to prevent thermal oxidation

Images