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Solidified composition forming as protective membrane, forming method of the membrance and the membrane

A curable composition and compound technology, which is applied in semiconductor/solid-state device parts, coatings, electrical components, etc., can solve the problem of difficult to obtain high surface smoothness, surface hardness of color filter layer protective film, acid resistance and resistance Alkalinity reduction, substrate deformation, etc.

Inactive Publication Date: 2003-04-30
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a protective film is formed on a resin substrate using a conventionally known curable composition for color filter protective film, discoloration problems such as substrate deformation and yellowing occur.
At this time, in order to avoid deformation and discoloration of the resin substrate, if the processing temperature in the process of forming the color filter protective film is lowered, the surface hardness, acid resistance and alkali resistance of the formed color filter protective film will be reduced, and the Problems with substrate adhesion
and it is difficult to obtain high surface smoothness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0074] The situation of the present invention will be described in detail below through examples, but the present invention is not limited within the scope of these examples. Synthesis Example 1 (Synthesis of Polymer [A1])

[0075] Into a flask equipped with a cooling tube and a stirrer, 5 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by weight of diethylene glycol ethyl methyl ether were added. Then add 25 parts by weight of styrene, 20 parts by weight of methacrylic acid, 45 parts by weight of glycidyl methacrylate and tricyclic [5.2.1.0 2，6 ] 10 parts by weight of decane-8-acyl, after carrying out nitrogen substitution, start stirring slowly. The temperature of the solution was raised to 70° C., and kept at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A1]. The solid component concentration of the obtained polymer solution was 33.0% by weight.

Synthetic example 2

[0076] The polystyrene conversion weight average molecular weight (Mw) of copolymer [A1] was 4,000. Synthesis example 2 (synthesis of polymer [A2])

[0077] Into a flask equipped with a cooling tube and a stirrer, 5 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by weight of diethylene glycol ethyl methyl ether were added. Next, 18 parts by weight of styrene, 20 parts by weight of methacrylic acid, 40 parts by weight of glycidyl methacrylate, and 22 parts by weight of cyclohexylmaleic anhydride imide were added, nitrogen replacement was carried out, and stirring was started slowly. The temperature of the solution was raised to 70° C., and kept at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A2]. The solid component concentration of the obtained polymer solution was 33.0% by weight.

Synthetic example 3

[0078] The polystyrene conversion weight average molecular weight (Mw) of copolymer [A2] was 20,000. Synthesis example 3 (synthesis of polymer [A3])

[0079] Into a flask equipped with a cooling tube and a stirrer, 5 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by weight of diethylene glycol ethyl methyl ether were added. Then add 5 parts by weight of styrene, 16 parts by weight of methacrylic acid, tricyclic methacrylic acid [5.2.1.0 2，6 ] 10 parts by weight of decane-8-acyl, 40 parts by weight of glycidyl methacrylate, and 5 parts by weight of butadiene were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70° C., and kept at this temperature for 5 hours to obtain a polymer solution containing the copolymer [A3]. The solid component concentration of the obtained polymer solution was 33.0% by weight.

[0080] The polystyrene conversion weight average molecular weight (Mw) of copolymer [A3] was 60,000...

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Abstract

The invention provides a curable composition for forming a protective film, the protective film and a method for forming the protective film. This curable composition comprises a copolymer of an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride, an epoxy group-containing unsaturated compound and an olefinically unsaturated compound other than the monomers, an epoxy resin other than the component and a compound capable of producing an acid with heat or radiations. The method for forming the protective film comprises coating the top surface of the resin substrate with the curable composition and then carrying out heat and / or light treatment. The treatment is carried out at a temperature without exceeding 180[deg.]C.

Description

technical field [0001] The present invention relates to a curable composition for forming a protective film, a method for forming a protective film, and a protective film. In more detail, the present invention relates to a curable composition suitable for forming a protective film, which can be used as a protective film for forming a color filter layer of a liquid crystal display element (LCD) on a resin substrate and for a charge-coupled device ( The material of the protective film of CCD) color filter layer, the present invention also relates to the formation method of protective film and protective film. Background technique [0002] Color liquid crystal display devices are most widely used in flat panel displays. [0003] In recent years, color liquid crystal display elements of the super twisted nematic (STN) system have spread rapidly because of their excellent characteristics such as contrast and viewing angle. Compared with the conventional twisted nematic (TN) typ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/00C08L63/00C09D5/00C09D157/00C09D163/00
CPCC08L57/00C08L63/00C08L2201/08C09D4/06C09D157/00C09D163/00H01L23/293
Inventor 马场厚高鸟正重丹羽一明
Owner JSR CORPORATIOON
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