Method and apparatus for treating substrate
一种处理方法、处理装置的技术,应用在电气元件、半导体/固态器件制造、电路等方向,能够解决高分子化反应没有充分地进行等问题,达到缩短固化处理时间、消除等待时间、处理时间缩短的效果
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[0044] Next, preferred embodiments of the present invention will be described. 1 is a plan view schematically showing an insulating film forming apparatus 1 for implementing a wafer W processing method according to this embodiment, FIG. 2 is a front view of the insulating film forming apparatus 1 , and FIG. 3 is a rear view of the insulating film forming apparatus 1 .
[0045] As shown in FIG. 1, the insulating film forming apparatus 1 has, for example, a cassette station 2 for loading and unloading wafers W from the outside to the insulating film forming apparatus 1 or loading and unloading wafers W to and from cassette C in cassette units of, for example, 25 wafers W. The first processing station 3 of various processing units that performs predetermined processing individually in the insulating film forming process is provided adjacent to the first processing station 3, and the interface unit 4 that performs delivery of the wafer W, etc., and has a The second processing stat...
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