Resin Encapsulation Apparatus And Resin Encapsulation Process
A resin sealing device and resin sealing technology are used in the manufacture of electrical components, electric solid state devices, semiconductor/solid state devices, etc., which can solve the problems of poor yield and damage of semiconductor components, achieve high productivity, suppress driving force, reduce The effect of open modulus
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[0086] refer to Figure 1 to Figure 14 The accompanying drawings illustrate embodiments of the resin sealing device of the present invention.
[0087] like figure 1 (A), figure 1 As shown in (B), the resin sealing device of this embodiment is a device for resin sealing an optical semiconductor element 2, such as an LED, mounted on a ceramic substrate 1 printed with a conductive pattern at a predetermined pitch. on one side.
[0088] As the resin sealing material for resin-sealing LEDs according to the present embodiment, a silicone material excellent in heat resistance and translucency is used as a main raw material. This above-mentioned resin sealing material is not only a solid material called a tablet (tablet) that has been used all the time, but also can obtain a desired shape by injecting a liquid resin sealing material into a mold, heating it, and thermally curing it. shape. For example, in the present application, the molded product 3 including a surplus resin (Jap...
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