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Grooving detection and intelligent sensing processing method and system for semiconductor

A semiconductor and groove detection technology, which is applied in image analysis, image enhancement, instruments, etc., can solve the problems that affect the semiconductor processing effect and processing accuracy, and do not perform groove detection, so as to realize intelligent perception and dynamic correction, ensure quality, Guarantee the effect of processing effect and processing accuracy

Active Publication Date: 2022-08-09
苏州镭明激光科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a semiconductor notch detection and intelligent sensing processing method and system to solve the problem of not performing notch detection in the existing semiconductor processing technology, so that the laser is not sensed and corrected, thereby affecting the semiconductor. Problems of processing effect and processing accuracy

Method used

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  • Grooving detection and intelligent sensing processing method and system for semiconductor
  • Grooving detection and intelligent sensing processing method and system for semiconductor
  • Grooving detection and intelligent sensing processing method and system for semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] like figure 1 As shown, a method for detecting grooves in a semiconductor includes:

[0101] S11: Acquire an original notch image containing at least one notch during the semiconductor laser cutting process.

[0102] In the process of semiconductor processing, such as the processing of semiconductor wafers containing Low-k materials in the dielectric layer, it is necessary to use laser grooving technology to shape the light spot into a specific shape through the optical path system, and focus the laser on the surface of the material to achieve a specific groove shape. And use the extremely high peak power of the ultrafast laser to instantly vaporize the Low-k material; there is no intermediate process in this process, which can greatly reduce the heat-affected zone, making the cutting very clean and free of residues.

[0103] In the above-mentioned laser grooving technology, the mainstream method is to first use Dual narrow cutting (ie double thin line cutting) to form...

Embodiment 2

[0205] like Figure 9 As shown, an intellisense processing method for Low-k materials, including:

[0206] S21: Laser cutting the semiconductor using a laser grooving tool;

[0207] S22: According to the groove detection method of Embodiment 1, calculate and obtain the real-time groove detection result in the semiconductor laser cutting process;

[0208] S23: Perform real-time correction on the semiconductor laser cutting process according to the real-time groove detection result to complete intelligent perception processing.

[0209] The intelligent perception processing method of this embodiment can realize real-time deviation correction in the laser processing process, effectively ensure the processing effect and processing accuracy of the semiconductor, and thus ensure high-quality integrated circuit products.

[0210] Preferably, S21 includes:

[0211] S211: using the laser grooving tool to form two narrow grooves in the dicing track of the semiconductor;

[0212] S21...

Embodiment 3

[0216] like Figure 10 As shown, a semiconductor groove inspection system includes:

[0217] The image acquisition module is used to acquire the original groove image containing at least one groove during the semiconductor laser cutting process;

[0218] an image processing module for preprocessing the original grooved image to obtain a processed grooved image;

[0219] a centerline search module, configured to obtain a pixel gradient map of the processed grooved image, and find out the centerline coordinates of the processed grooved image according to the pixel gradient map;

[0220] a boundary determination module, configured to determine the boundary position of each of the grooves according to the centerline coordinates and the pixel gradient map;

[0221] The result calculation module is used for calculating the groove detection result according to all the boundary positions.

[0222]The groove detection system of this embodiment can accurately obtain the groove detect...

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Abstract

The invention discloses a semiconductor notch groove detection and intelligent sensing processing method and system. The detection method comprises the following steps: acquiring an original notch groove image containing at least one notch groove in a semiconductor laser cutting process; preprocessing the original grooving image to obtain a processed grooving image; acquiring a pixel gradient map of the processed grooving image, and finding out a center line coordinate of the processed grooving image according to the pixel gradient map; determining the boundary position of each notch groove according to the center line coordinate and the pixel gradient map; and according to all the boundary positions, calculating to obtain a notch groove detection result. According to the method, the grooving detection result in the semiconductor machining process can be accurately obtained, the obtained grooving detection result can be conveniently compared with the set grooving groove type, intelligent sensing and dynamic deviation correction in the semiconductor laser machining process are achieved, the machining effect and machining precision of the semiconductor are effectively guaranteed, and the machining efficiency of the semiconductor is improved. And the quality of the final chip is ensured.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a method and system for groove detection and intelligent perception processing of semiconductors. Background technique [0002] In the field of semiconductor processing, it is usually necessary to cut the dielectric layer on the wafer substrate in the wafer scribe line. At present, there are three cutting methods, one is the traditional cutter wheel cutting method, the second is the laser hot melt cutting method, and the third is the laser cold processing method. [0003] With the increase in chip integration and performance requirements, the line width is getting smaller and smaller, resulting in a narrower dicing width. In addition, the wafer thickness becomes extremely thin (less than 120um), and generally has a dielectric layer containing metals, Low-k, GaN and other materials. Under the above background, the traditional cutter wheel cutting method has defects such...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/11G06T7/68G06T5/20G06T5/30
CPCG06T7/0004G06T7/68G06T7/11G06T5/20G06T5/30G06T2207/30148
Inventor 施心星
Owner 苏州镭明激光科技有限公司
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