Optical module

Abstract

The optical module provided by the invention comprises a lower shell; a through hole is formed in the top of the upper shell and penetrates through the upper surface and the lower surface of the upper shell; the circuit board is arranged in a wrapping cavity formed by matching the upper shell and the lower shell; the high heat density component is arranged on the surface of the circuit board; the radiator is arranged on the upper surface of the upper shell; the soaking component is arranged on the upper surface of the upper shell, and one side of the soaking component is in contact with the radiator; the heat conduction component is embedded in the through hole and penetrates through the interior and the exterior of the wrapping cavity, the top of the heat conduction component is in contact with the soaking component, and the bottom of the heat conduction component is in contact with the high-heat-density component; the heat conduction efficiency of the radiator, the heat conduction efficiency of the soaking component and the heat conduction efficiency of the heat conduction component are all larger than the heat conduction efficiency of the upper shell. According to the optical module provided by the invention, a mode of combining the radiator, the soaking component and the heat conduction component is adopted, so that heat dissipation of the high-heat-density component in the optical module is accelerated, heat is prevented from being gathered around the high-heat-density component, and temperature homogenization in the optical module is facilitated.

Description

technical field [0001] The present application relates to the technical field of optical fiber communication, and in particular, to an optical module. Background technique [0002] Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video. The optical module realizes the function of photoelectric conversion in the field of optical communication technology, and is one of the key components in optical communication equipment. The optical signal intensity input by the optical module to the external optical fiber directly affects the quality of optical fiber communication. [0003] At present, with the continuous improvement of the transmission rate requirements of optical modules, the integration of optical modules is getting higher and higher. As the integration of optical modules is getting higher and higher, the power density of optical modules is also increasing; and based on the characteristics ...

AI Technical Summary

Problems solved by technology

Therefore, when the power density of chips (such as digital signal processing, DSP) and optical components is too high, the heat concentrated in chips, optical components, etc., if the heat concentrated in chips, optical components, etc. cannot be diffused in time, local high temperature areas , will seriously affect the photoelectric performance of the optical module at high temperature

And with the increase of the optical module rate, the power consumption of chips and optical components is increasing, and the power consumption has even reached 20-30W. The traditional heat dissipation method is difficult to meet the heat dissipation requirements of the chip and optical components. Rapid internal heat dissipation becomes a thorny issue

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