Soldering flux for wave soldering and manufacturing method thereof

Abstract

The invention relates to a soldering flux for wave soldering and a manufacturing method thereof. The soldering flux comprises the following raw materials in percentage by mass: 2-5% of an organic acid activator; 1.5%-3.5% of a surfactant; 0.5-1% of a film forming agent; 0.05 to 0.07 percent of a corrosion inhibitor; the balance of a carrier solvent; wherein the organic acid activating agent is a mixture of two or more of succinic acid, adipic acid, malic acid and sebacic acid; the surfactant is a mixture of two or more of triethanolamine, butyl acetate, EDTA (Ethylene Diamine Tetraacetic Acid) disodium and N-dodecyl alanine; the film-forming agent is prepared by mixing polyacrylamide, ethylene diamine tetra (methylene sodium phosphate) and polyoxyethylene according to the mass ratio of (1 to 1.2) to (0.5 to 0.7) to (0.2 to 0.4); the carrier solvent is prepared by mixing ethyl cellulose and an alcohol ether solvent according to a mass ratio of 1: 6. The soldering flux has the effects of improving the soldering aiding effect of the soldering flux and reducing corrosion residues of the soldering flux.

Description

technical field [0001] The present application relates to the field of flux, in particular to a flux for wave soldering and a manufacturing method thereof. Background technique [0002] At present, the electronic industry often uses wave soldering technology in the welding process. Wave soldering is to make the welding surface of the plug-in board directly contact with the high temperature liquid tin to achieve the purpose of welding. [0003] There are oxides, dust and other dirt on the surface of the metal workpiece to be welded, which hinders the bonding between the workpiece base metal and the solder, so it is usually necessary to add flux during the welding process. The flux includes activators, solvents, surfactants, and film-forming agents. The activator in the flux removes the oxides on the surface of the metal matrix, and the film-forming agent assists in reducing the oxidation of the metal surface and maintains the oxide-free state of these surfaces. Relying on th...

AI Technical Summary

Problems solved by technology

[0004] However, during the use of wave soldering fluxes, it was found that although the use of water-soluble fluxes and rosin fluxes has better solderability, the residual corrosion also increases, which is not conducive to the subsequent use of electronic products; Although cleaning flux has less residual corrosion, its fluxing effect is not as good as that of water-soluble flux and rosin flux

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