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Preparation method of copper-silver composite material

A composite material, copper-silver technology, which is applied in the field of copper-silver composite material preparation, can solve the problems of monotonous color and high cost, and achieve the effects of changing patterns, low cost, strong artistic sense and admiration.

Inactive Publication Date: 2022-06-28
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Silver is widely used in the preparation of cups, jewelry, tableware and other fields. The products on the existing market are basically made of pure silver, which has high cost and monotonous color.

Method used

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  • Preparation method of copper-silver composite material
  • Preparation method of copper-silver composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method of a copper-silver composite material, specifically comprising the following steps:

[0023] (1) Grind the pure copper plate and silver plate to ensure that the surface of the pure copper plate and silver plate is smooth without pits, soak in dilute hydrochloric acid to remove the surface oxide layer, and then clean the pure copper plate and silver plate.

[0024] (2) Alternately stack pure copper plates and silver plates with a thickness of 10mm, put them directly into a graphite mold until the thickness of the rough blank is 130mm, and then put the mold into a spark plasma sintering furnace for sintering, under vacuum conditions At first, the temperature was raised to 230°C and then kept for 2 minutes, then the temperature was raised to 650°C and then kept for 25 minutes. During the sintering process, a pressure of 15Mpa was applied to the pure copper plate and the silver plate. After the sintering was completed, the furnace was cooled to room temp...

Embodiment 2

[0030] A preparation method of a copper-silver composite material, specifically comprising the following steps:

[0031] (1) Grind the pure copper plate and silver plate to ensure that the surface of the pure copper plate and silver plate is smooth without pits, soak in dilute hydrochloric acid to remove the surface oxide layer, and then clean the pure copper plate and silver plate.

[0032] (2) Alternately stack pure copper plates and silver plates with a thickness of 15mm, put them directly into a graphite mold, until the thickness of the rough blank is 150mm, and then put the mold into a discharge plasma sintering furnace for sintering, and fill it with purity 99.999% argon with a flow rate of 80ml / min was used for protective sintering. First, the temperature was raised to 250°C and then kept for 1min. Then, the temperature was raised to a sintering temperature of 680°C and then kept for 20min. During the sintering process, a pressure of 10Mpa was applied to the pure copper ...

Embodiment 3

[0038] A preparation method of a copper-silver composite material, specifically comprising the following steps:

[0039] (1) Grind the pure copper plate and silver plate to ensure that the surface of the pure copper plate and silver plate is smooth without pits, soak in dilute hydrochloric acid to remove the surface oxide layer, and then clean the pure copper plate and silver plate.

[0040] (2) Alternately stack pure copper plates and silver plates with a thickness of 14mm, put them directly into a graphite mold until the thickness of the rough blank is 140mm, and then put the mold into a spark plasma sintering furnace for sintering, under vacuum conditions At first, the temperature was raised to 200°C and then kept for 2min, then the temperature was raised to 660°C and then kept for 22min. During the sintering process, a pressure of 30Mpa was applied to the pure copper plate and the silver plate. After the sintering was completed, it was cooled to room temperature with the fu...

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Abstract

The invention discloses a preparation method of a copper-silver composite material, and belongs to the technical field of preparation and processing of silver. The method comprises the following steps: polishing pure copper plates and silver plates, alternately stacking the pure copper plates and the silver plates, then carrying out spark plasma sintering to prepare a rough blank, and detaching the rough blank; the rough blank is longitudinally cut into a cylindrical metal rod, the two ends of the metal rod are fixed, torsional deformation is conducted, and heating is conducted in the torsional process; and twisting, forging, rolling, polishing and waxing to obtain a final product. The pattern of the copper-silver composite material prepared by the method is stripe-shaped, and the copper-silver composite material is composed of pure copper and pure silver which are distributed alternately, has strong artistic sense and ornamental value, and is widely applied to preparation of jewelry, ornaments and artworks.

Description

technical field [0001] The invention relates to a preparation method of a copper-silver composite material, and belongs to the technical field of silver preparation and processing. Background technique [0002] Sterling silver is a beautiful silver-white metal. It not only has economic value, but also is beautiful and can be used as a drug testing tool. The ancients said that carrying silver will be accompanied by health and wealth, not only because of its precious metal, medically, It is more effective than gold for human health. Silver has excellent antibiotic and sterilization effects. General antibiotics can only work on 6 kinds of germs on average, but silver can kill 650 kinds of germs. Modern medicine believes that silver can sterilize and reduce inflammation, detoxify health, prolong life, and long-term use can accelerate metabolism and enhance resistance. It can be seen that often wearing silver jewelry is beneficial to health without any harm; Li Shizhen recorded...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00C22F1/08C22F1/14
CPCB23P15/00C22F1/08C22F1/14
Inventor 孙鸿雁
Owner KUNMING UNIV OF SCI & TECH
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