Preparation method of low-defect silicon carbide epitaxial material
A technology of epitaxial materials and silicon carbide, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems that restrict device performance, achieve low surface defect density, uniform temperature field, and reduce inhomogeneity
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[0021] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with specific embodiments.
[0022] Embodiments of the present invention firstly provide a method for preparing a low-defect silicon carbide epitaxial material.
[0023] Please refer to figure 1 , is a schematic diagram of a method for preparing a low-defect silicon carbide epitaxial material provided by the first embodiment of the present invention.
[0024] The first stage is the preparatory work before preparation, which specifically includes: transferring the cleaned silicon carbide off-axis substrate to the graphite disk base in the CVD equipment, and the CVD equipment is vacuumed. In this embodiment, the silicon carbide off-axis substrate is a 4H-SiC or 6H-SiC substrate that is biased to the silicon surface of the direction by 0.2-8° (0001), and the CVD equipment adopts hot-wall CVD equipment, in other embodiments,...
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