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Medium and low temperature curing electrothermal slurry and preparation method thereof

A slurry and low temperature technology, which is applied in the field of medium and low temperature curing electric heating slurry and its preparation, can solve the problems of easy deformation of the substrate, large resistance value deviation, high cost of slurry, etc., and achieve precise control of precision and resistance value deviation The effect of small, medium and low temperature energy consumption is small

Pending Publication Date: 2022-05-10
谢金龙
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantages of traditional resistance paste are: firstly, the cost of the paste is high, and secondly, due to the high sintering temperature, the disadvantages are: large energy consumption, easy deformation of the substrate, and large deviation of resistance value, which limits the aluminum substrate and other medium and low temperature materials. Applications

Method used

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Examples

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preparation example Construction

[0024] A method for preparing medium and low temperature curing electric heating slurry, comprising the following steps:

[0025] (1) Prepare raw materials for the slurry, prepare graphite powder, carbon powder, white carbon black, nickel powder, molybdenum powder, boron nitride, silicon carbide, silver powder, binder, additive, and solvent according to a certain weight ratio, and then Fully mix the configured raw materials;

[0026] (2) Stir and grind, place the raw materials mixed in step (1) in a container for stirring, and perform three-roll rolling after stirring and dispersing;

[0027] (3) Constant temperature formation, put the mixed material rolled in step (2) into a stainless steel or ceramic container, put it into a special vacuum constant temperature stirrer, and stir at a constant speed to fully react the components of the slurry to make a resistor slurry;

[0028] (4) Curing at medium and low temperature. After the resistance paste in step (3) is printed with a...

Embodiment 1

[0035] Raw material composition and weight ratio: graphite powder 3%, carbon powder 1%, white carbon black 1%, nickel powder 8%, molybdenum powder 3%, boron nitride 5%, silicon carbide 2%, silver powder 6%, binder 60%, additive 1%, solvent 10%.

Embodiment 2

[0037] Raw material composition and weight ratio: graphite powder 15%, carbon powder 0.5%, white carbon black 2%, nickel powder 4%, molybdenum powder 5%, boron nitride 7%, silicon carbide 1%, silver powder 10%, binder 40%, additives 0.5%, solvent 15%.

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Abstract

The invention relates to the field of electric heating paste, in particular to medium and low temperature curing electric heating paste and a preparation method thereof, and the medium and low temperature curing electric heating paste comprises the following raw materials by weight: 3-15% of graphite powder, 0.5-6% of carbon powder, 0.1-3% of white carbon black, 3-10% of nickel powder, 1-15% of molybdenum powder, 0.5-10% of boron nitride, 1-4% of silicon carbide, 0.1-25% of silver powder, 35-70% of a binder, 0.1-3% of an auxiliary agent, and 0.1-15% of a solvent. A medium-low temperature curing mode is adopted, the curing process is simple, medium-low temperature energy consumption is small, it can be guaranteed that the substrate is not prone to deformation, precision control is more accurate, the resistance value deviation can be small, and the medium-low temperature curing mode can further improve the effect of being used in cooperation with other carrier materials with low melting points.

Description

technical field [0001] The invention relates to the field of electric heating paste, in particular to a medium-low temperature curing electric heating paste and a preparation method thereof. Background technique [0002] With the development of science and technology in today's society, in the technical fields of electricity, electronics, electric heating, chips, etc., the thick film components used for microcircuits and hybrid integrated circuits, the product requirements of different resistivities, are widely used in various electrical and electronic devices middle. Traditional silver palladium resistor paste and ruthenium resistor paste are expensive. During production and processing, screen printing is used to print on the stainless steel substrate, and then it is made by sintering at 550-850 degrees. [0003] The disadvantages of traditional resistance paste are: firstly, the cost of the paste is high, and secondly, due to the high sintering temperature, the disadvant...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/00
Inventor 谢金龙
Owner 谢金龙
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