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Thermoplastic polyimide resin material with low thermal expansion coefficient and preparation method thereof

A technology of polyimide resin and low thermal expansion coefficient, which is applied in the field of low thermal expansion coefficient thermoplastic polyimide material and its preparation, and can solve the problem of decreased mechanical and thermal properties of resin products, decreased high temperature stability of resin, and reduced mechanical properties of resin etc., to achieve the effects of reducing processing temperature and melt viscosity, improving thermoplastic processability, and increasing melt index

Pending Publication Date: 2022-05-10
宁波惠璞新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of low-molecular-weight polyimide resin, the high-temperature stability of the resin is reduced, and the addition of low-molecular-weight polyimide resin will also reduce the mechanical properties of the original resin to a certain extent, resulting in a limited amount of addition, which must be less than 1%
The applicant's experiment shows that if the addition of low molecular weight polyimide resin exceeds 1%, the mechanical and thermal properties of the resin product will drop significantly
Moreover, even if the addition amount is less than 1%, the melt index value drops significantly after multiple melting

Method used

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  • Thermoplastic polyimide resin material with low thermal expansion coefficient and preparation method thereof
  • Thermoplastic polyimide resin material with low thermal expansion coefficient and preparation method thereof
  • Thermoplastic polyimide resin material with low thermal expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The composition content of a kind of low thermal expansion coefficient thermoplastic polyimide resin is as follows:

[0043] (1) High temperature resistant thermoplastic polyimide resin with a glass transition temperature greater than 250°C and a thermal expansion coefficient less than 40ppm / K: 94% by mass;

[0044] Its structural formula is as follows:

[0045]

[0046] It is prepared according to the preparation method disclosed in Example 1 of the patent CN 111057236 A (application number 201911214345.6).

[0047] Its inherent viscosity is 0.68dL / g, glass transition temperature is 295°C, and thermal expansion coefficient is 23ppm / K. .

[0048] (2) Antioxidant 1010: 0.5% by mass;

[0049] (3) Lubricant PETS: 0.5% by mass;

[0050](4) Thermoplastic polyimide resin with glass transition temperature lower than 220°C: 5% by mass.

[0051] The commercial polyimide resin Ultem 1000 is used, its glass transition temperature is 217°C, its inherent viscosity is 0.36dL / ...

Embodiment 2

[0054] The composition content of a kind of low thermal expansion coefficient thermoplastic polyimide resin is as follows:

[0055] (1) High temperature resistant thermoplastic polyimide resin with a glass transition temperature greater than 250°C and a thermal expansion coefficient less than 40ppm / K: the content is 90%;

[0056] Its structural formula is as follows:

[0057]

[0058] Its inherent viscosity is 0.68dL / g, glass transition temperature is 295°C, and thermal expansion coefficient is 23ppm / K. .

[0059] (2) Antioxidant 1010: 0.3%;

[0060] (3) Lubricant paraffin: 0.7%;

[0061] (4) Thermoplastic polyimide resin with a glass transition temperature of less than 220°C: 9%.

[0062] The commercial polyimide resin Ultem 1000 is used, its glass transition temperature is 217°C, its inherent viscosity is 0.36dL / g, and its melt index is 5g / 10min under the test condition of 315°C / 12.5kg.

[0063] The extrusion temperature of WELLZOON brand C-type high-temperature desk...

Embodiment 3

[0065] The composition content of a kind of low thermal expansion coefficient thermoplastic polyimide resin is as follows:

[0066] (1) High temperature resistant thermoplastic polyimide resin with a glass transition temperature greater than 250°C and a thermal expansion coefficient less than 40ppm / K: the content is 95%;

[0067] Its structural formula is as follows (n / m=2:1):

[0068]

[0069] Its inherent viscosity is 0.60dL / g, glass transition temperature is 261°C, and thermal expansion coefficient is 39ppm / K.

[0070] (2) Antioxidant 168: 0.8%;

[0071] (3) Lubricant PETS: 0.2%;

[0072] (4) Thermoplastic polyimide resin with a glass transition temperature of less than 220°C: 4%.

[0073] The commercial polyimide resin Ultem 1010 is used, its glass transition temperature is 217°C, its inherent viscosity is 0.34dL / g, and its melt index is 6g / 10min under the test condition of 315°C / 12.5kg.

[0074] The extrusion temperature of the WELLZOON brand C-type high-temperatur...

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Abstract

The invention discloses a thermoplastic polyimide resin material with a low thermal expansion coefficient. The thermoplastic polyimide resin material is prepared from the following components in percentage by mass: 80-99% of high-temperature-resistant thermoplastic polyimide resin of which the glass transition temperature is greater than 250 DEG C and the thermal expansion coefficient is less than 40ppm / K; 0.1-15% of thermoplastic polyimide resin having a glass transition temperature of less than 220 DEG C and a logarithmic viscosity of more than 0.30 dL / g; 0.2 to 5% of an antioxidant; and 0.2-5% of a lubricant. The invention further provides a preparation method. According to the invention, by blending with the high-molecular-weight and high-melt-index thermoplastic polyimide resin with the glass transition temperature of less than 220 DEG C and the logarithmic viscosity of more than 0.30 dL / g, and matching with the antioxidant and the lubricant, the thermoplastic processability of the resin is improved, the processing temperature and melt viscosity are reduced, and the mechanical properties of the resin are improved. The melt index, the thermoplastic stability and the service life of the product are improved.

Description

technical field [0001] The invention relates to the technical field of thermoplastic polyimide materials, in particular to a low thermal expansion coefficient thermoplastic polyimide material and a preparation method thereof. Background technique [0002] Polyimide is a kind of resin material with excellent comprehensive properties. It has good thermal stability, excellent mechanical properties, good dimensional stability, excellent chemical stability, high breakdown voltage, low dielectric constant, high With the advantages of flame retardancy and low expansion coefficient, it is widely used in high-tech fields such as electronic appliances, aerospace, automobiles, and chemical machinery. On the other hand, due to the rigid molecular chains of polyimide and the strong interaction between molecules, it is difficult to melt the polymer, which limits the processing and application range of polyimide. Therefore, many methods have been developed to improve the performance of pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L91/06C08K5/134C08K5/103C08K5/526
CPCC08L79/08C08L2205/025C08K5/1345C08K5/103C08L91/06C08K5/526
Inventor 李青璇
Owner 宁波惠璞新材料有限公司
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