Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Titanium-copper alloy etching solution and etching method

A technology of titanium-copper alloy and etching solution, which is applied in the field of circuit etching, can solve problems such as low elastic modulus recovery, small etching factor, and large side erosion, and achieve the effects of reducing side erosion, improving etching precision, and reducing contact

Pending Publication Date: 2022-04-22
AKM ELECTRONICS INDAL PANYU
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Titanium-copper alloy has the advantages of high strength, low elastic modulus, and good recovery, so it can meet the requirements of the support layer of the flexure device (it can realize small-scale displacement and return to the original state), but at the same time, its chemical corrosion resistance making it difficult to process
When using the existing etching solution to etch titanium-copper alloy, there are usually problems such as large side erosion, small etching factor and low etching precision

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Titanium-copper alloy etching solution and etching method
  • Titanium-copper alloy etching solution and etching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0027] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a titanium-copper alloy etching solution and an etching method. The etching solution comprises inorganic acid, copper salt and a corrosion inhibitor. The inorganic acid is used for providing hydrogen ions in an acidic environment, and the acidic environment is beneficial to excitation of oxidability of copper ions in the copper salt, so that the copper ions react with the titanium-copper alloy, and etching of the titanium-copper alloy is achieved. After the copper salt is dissolved, copper ions have strong oxidizing property in an acid environment and can react with the titanium-copper alloy, so that etching of the titanium-copper alloy is realized. The corrosion inhibitor is added into the etching solution, the corrosion inhibitor can be dissolved in the etching solution and has good affinity with the titanium-copper alloy, the corrosion inhibitor can be attached to the side wall of the titanium-copper alloy in the etching process, contact between the side wall and the etching solution is reduced, then lateral erosion is reduced, and the etching precision is improved.

Description

technical field [0001] The invention relates to the technical field of circuit etching, in particular to a titanium-copper alloy etching solution and an etching method. Background technique [0002] The micro-actuation structure is used in high-precision imaging equipment such as mobile phone cameras, car cameras, electronic imaging microscopes, and flexible precision devices. axis) for small size (micrometer to millimeter) position shift / restoration for anti-shake and zoom. [0003] The micro-actuating structure usually includes a driving device and a flexure device. The driving device is used to provide a driving force for driving the lens to move, and the flexure device is used to provide a carrier for the lens to move. The driving device drives the lens to move by driving the flexure device to move. The deflection device is also used to transmit sensing signals so that the processor can know the position of the lens and perform accurate compensation. Therefore, the fle...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23F1/26C23F11/14
CPCC23F1/26C23F11/149
Inventor 邹凯然潘丽曹广盛
Owner AKM ELECTRONICS INDAL PANYU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products