Double-sided etching device and etching process for metal radiating fin

A double-sided etching and heat sink technology, applied in the field of etching, can solve problems such as low efficiency, repeated positioning errors, and increased production costs

Pending Publication Date: 2022-07-29
扬州赛诺高德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method obviously has the following disadvantages: the current metal heat sink double-sided etching process has low efficiency, some intermediate processes are repetitive and complicated, and the production cost is increased; It is easy to cause repeated positioning errors, resulting in misalignment of etched patterns

Method used

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  • Double-sided etching device and etching process for metal radiating fin
  • Double-sided etching device and etching process for metal radiating fin
  • Double-sided etching device and etching process for metal radiating fin

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Embodiment Construction

[0037] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the embodiments and the accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0038] like Figure 1 to Figure 7 As shown in the figure, the present invention provides a double-sided etching device for a metal heat sink, including a spray mechanism (not shown in the figure) and a flip mechanism, the spray mechanism is used to spray the etching solution on the metal heat sink, and the flip mechanism includes a body 1. The first clamping mechanism 2, the first overturning mechanism 3, the second clamping mechanism 4 and the second overturning mechanism 5 are all arranged on the body 1. The first clamping mechanism 2 and the second clamping mechanism 4 are respectively ...

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Abstract

The invention relates to the technical field of etching, in particular to a double-sided etching device for a metal cooling fin and an etching process applied to the double-sided etching device. The turnover mechanism comprises a machine body, a first clamping mechanism, a first turnover mechanism, a second clamping mechanism and a second turnover mechanism, the first clamping mechanism, the first turnover mechanism, the second clamping mechanism and the second turnover mechanism are arranged on the machine body, the first clamping mechanism and the second clamping mechanism are used for clamping the two sides of the metal cooling fin correspondingly, and the first turnover mechanism is used for driving the first clamping mechanism to turn over; the second turnover mechanism is used for driving the second clamping mechanism to turn over. The first clamping mechanism and the second clamping mechanism are used for clamping the two ends of the metal cooling fin correspondingly, after one face of the metal cooling fin is etched, the first overturning mechanism and the second overturning mechanism are used for driving the first clamping mechanism and the second clamping mechanism to overturn at the same time correspondingly, and then the metal cooling fin can be overturned; therefore, the other side of the metal radiating fin is etched.

Description

technical field [0001] The invention relates to the technical field of etching, in particular to a double-sided etching device and an etching process for a metal heat sink. Background technique [0002] Metal heat sinks are widely used in high power density and integrated electronic devices to reduce the heat accumulation of heating components and prolong the working life of the devices. At present, the metal heat sink can be used as the shell of the phase change heat transfer device, and the high-wetting performance liquid absorbing core is encapsulated inside. After sealing and vacuuming the working medium, it becomes an efficient phase change heat transfer device with good thermal conductivity. The metal heat sink can also be used as a common heat sink, and microarray columns are etched on the upper and lower surfaces of the metal heat sink to increase the specific surface area of ​​the metal heat sink, thereby improving the heat dissipation efficiency of the metal heat s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/02C23F1/08
CPCC23F1/08C23F1/02
Inventor 王文涛张亮旗王世权张帆
Owner 扬州赛诺高德电子科技有限公司
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