A plasma etching device for etching optical devices

Abstract

The invention discloses a plasma etching device for etching optical devices, which comprises a casing, a workbench and a cabinet arranged in sequence from top to bottom, a suction cup is welded on the top of the extension end of a hollow shaft, and a hollow shaft is connected between the output shaft of the motor and the hollow shaft. There is a transmission device that can drive the hollow shaft to rotate. The top of the horizontal tube is welded with an electrode column, and the upper end of the electrode column is welded with an electrode sheet. The electrode sheet contacts the inner wall of the top of the suction cup. The lower end of the electrode column extends into the horizontal tube and extends A wire B is fixed on the end, and the extension end of the wire B is connected to a second high-frequency power supply; the cover plate is provided with an antenna extending into the airtight cavity, the top of the antenna is connected to a wire A, and the other end of the wire A is connected to There is a first high-frequency power supply; the shell is provided with a solenoid valve and a pressure relief valve, and the other end of the solenoid valve is connected with a gas cylinder storing a gas source. The beneficial effect of the invention is that the etching efficiency is improved, the optical device cooling efficiency is improved, and the degree of automation is high.

Description

technical field [0001] The invention relates to the technical field of etching on optical devices, in particular to a plasma etching device for etching optical devices. Background technique [0002] Optical devices, including filters, lenses, polarizers, etc., are one of the indispensable and important components of electronic products. The surface of most optical devices is etched with grooves for installing circuits, wires or other small electronic components. To process the grooves, plasma etching equipment is usually used for etching. Adhesive protective film (40), to be etched part (41) exposed as figure 1 As shown, the optical device (42) is then put into the plasma etching device, and the plasma generated in the plasma etching device reacts with the part to be etched (41) to be removed, finally obtaining the groove of the desired shape . However, the existing plasma etching device has the following defects: 1. The optical device is thick, and it takes a long time t...

AI Technical Summary

Problems solved by technology

However, the existing plasma etching device has the following defects: 1. The optical device is thick, and it takes a long time to obtain a deep groove, and there is a defect of low etching efficiency

2. The thickness of the optical device itself is uneven, resulting in uneven depth of the final groove

3. Optical devices generate a lot of heat during etching. When the product is taken out, it needs to be air-cooled, and the long air-cooling time will undoubtedly reduce the production efficiency

4. Optical devices are tooled with special fixtures, which not only slows tooling efficiency, but also further reduces etching efficiency

Images