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Preparation method of circuit board

A technology for circuit boards and multilayer circuit substrates, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve problems that are not conducive to the etching of dense lines on circuit boards, and achieve the effect of ensuring continuity

Pending Publication Date: 2022-02-01
宏华胜精密电子(烟台)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, in order to ensure the thickness of the copper plating layer in the through hole, the thickness of the copper plating layer on the substrate surface will be larger, which is not conducive to the etching of dense lines on the circuit board

Method used

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  • Preparation method of circuit board
  • Preparation method of circuit board
  • Preparation method of circuit board

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Embodiment Construction

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments.

[0048] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood...

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Abstract

The invention provides a preparation method of a circuit board. The method comprises the following steps of: providing a multi-layer circuit substrate which has a through hole; respectively forming a first copper plating layer and a second copper plating layer on the surface of the multi-layer circuit substrate and the inner wall of the through hole, wherein the through hole with the second copper plating layer forms a plated through hole; filling an insulating material in the plated through hole, and baking the insulating material to form an insulator to obtain an intermediate; placing the intermediate in an etching liquid medicine, and enabling the etching liquid medicine to carry out thinning treatment on the first copper plating layer; removing the insulator; and etching the thinned first copper plating layer into an outer circuit, thereby acquiring the circuit board. According to the preparation method, the insulator is arranged in the plated through hole, so that the second copper plating layer is prevented from being etched due to contact between the second copper plating layer and the liquid medicine.

Description

technical field [0001] The present application relates to the technical field of circuit board production, and in particular, to a method for preparing a circuit board. Background technique [0002] During the preparation process, a copper plating layer is usually formed on the surface of the substrate and in the through holes opened in the substrate by means of copper electroplating, and the through hole with the copper plating layer is a PTH Plating Through Hole. In order to ensure the conduction performance of the circuit board, the copper plating layer in the through hole needs to meet a certain thickness. However, since the fluidity of the liquid medicine on the surface of the substrate is better than that of the through hole, the thickness of the copper plating layer on the surface of the substrate is greater than the thickness of the copper plating layer in the through hole. Therefore, in order to ensure the thickness of the copper plating layer in the through hole, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K3/00
CPCH05K3/4644H05K3/424H05K3/0094
Inventor 陈健
Owner 宏华胜精密电子(烟台)有限公司
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