Copper electroplating formula for pulse through hole filling and electroplating process thereof

Abstract

The invention discloses an electrocoppering formula for pulse through hole filling and an electroplating process thereof. The electrocoppering formula comprises, by mass concentration, 60-90 g / L of copper salt, 150-200 g / L of concentrated sulfuric acid, 30-90 mg / L of an inhibitor, 10-30 mg / L of a leveling auxiliary agent, 1-8 g / L of an accelerator, 20-60 mg / L of a positioning agent, 15-45 mg / L of a dispersing agent and 15-45 mg / L of a brightening agent. The solution provided by the invention ensures that the orifice of the through hole is not broken, for a plate with the thickness-diameter ratio of more than 15: 1, the deep plating capacity is more than 95%, the thickest thickness of the hole filling plate can be more than 3.5 mm, and the hole filling rate is kept more than 95%.

Description

technical field [0001] The invention relates to the technical field of copper electroplating, in particular to a formula for electroplating copper for pulse through-hole filling and an electroplating process thereof. Background technique [0002] The pulse electroplating process has the advantages of low time length, deep plating ability, and good dispersion ability. At present, there are many methods of cycle-changing pulse electroplating technology used in PCB circuits, and whether the product can achieve the required performance and requirements often depends on the quality of the electroplating solution. At present, with regard to pulse electroplating potions, MacDermid has always been the only one, and domestic similar products cannot compete with it. The important reason is that the deep plating ability and performance requirements of high thickness-to-diameter ratio have always been the shortcomings of domestic potions. . [0003] Yan Dehao and others disclosed a thr...

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Problems solved by technology

[0002] The pulse electroplating process has the advantages of low time length, deep plating ability, and good dispersion ability. At present, there are many methods of cycle-changing pulse electroplating technology used in PCB circuits, and whether the product can achieve the required performance and requirements often depends on the quality of the electroplating solution. At present, with regard to pulse electroplating potions, MacDermid has always been the only one, and domestic similar products cannot compete with it. The important reason is that the deep plating ability and performance requirements of high thickness-to-diameter ratio have always been the shortcomings of domestic potions.

[0003] Yan Dehao and others disclosed a through-hole pulse electroplating solution and a through-hole pulse electroplating coating method in the patent CN113881983A. The electroplating coating method uses air stirring, which will make oxygen easily enter the solution and cause an chemical copper layer in the hole copper. Oxidation corrosion, especially thin lines such as IC substrates will cause problems such as circuit disconnection

[0004] In addition, Cai Fangxian and others disclosed the application of a pulse electroplating additive electroplating solution and electroplating in the patent CN113373482A. Due to the lack of an accelerator, the production cost is increased, and the contained surfactant component has a lot of foam, which is not conducive to operations such as pumping.

[0005] Therefore, there is an urgent need in the market for a copper electroplating solution that can achieve a high aspect ratio (greater than 15:1) and will not achieve nearly 95% deep plating and hole filling plating on boards with thin lines (lines less than 50 microns). Satisfy production needs and lift foreign technology blockade

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