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Epoxy thermosetting resin and preparation method thereof

A technology of epoxy thermosetting and epoxy resin, applied in the field of polymer resin, to achieve the effect of simple preparation method

Pending Publication Date: 2022-04-15
江苏富琪森新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of epoxy thermosetting resin and preparation method thereof, solve the problem that the prior art cannot obtain the epoxy resin composition of different structures through solid phase fusion

Method used

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  • Epoxy thermosetting resin and preparation method thereof
  • Epoxy thermosetting resin and preparation method thereof
  • Epoxy thermosetting resin and preparation method thereof

Examples

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preparation example Construction

[0026] The invention provides a kind of preparation method of epoxy thermosetting resin, comprises the following steps:

[0027] (1) Mix the epoxy resin and the disulfide-containing amine compound, add the solvent and let it stand in the mold. After the solvent evaporates, let it stand at 110-130°C for 10-14 hours to obtain the disulfide bond exchange-dynamic epoxy network;

[0028] (2) Mix the epoxy resin and the amine compound containing diselenide, add the solvent and let it stand in the mold. After the solvent evaporates, let it stand at 110-130°C for 10-14 hours to obtain the diselenide bond exchange-dynamic epoxy network;

[0029] (3) Disulfide bond exchange-dynamic epoxy network and diselenide bond exchange-dynamic epoxy network are mixed and hot pressed to obtain epoxy thermosetting resin;

[0030] Wherein, step (1) and step (2) have no order limitation.

[0031] In the present invention, the epoxy resin in step (1) and step (2) is independently preferably ethylene ...

Embodiment 1

[0047] The present embodiment provides a kind of epoxy thermosetting resin, and its preparation method comprises the following steps:

[0048](1) Mix 8mmol of bisphenol F diglycidyl ether and 4mmol of cystamine, add 5mL of tetrahydrofuran, stir evenly, place in a 50mm*50mm*2mm polytetrafluoroethylene film, and wait for the solvent to evaporate to dryness, at 120°C After standing for 12 hours, a disulfide bond exchange-dynamic epoxy network was obtained, denoted as P1-1;

[0049] Mix 8mmol of bisphenol A diglycidyl ether and 4mmol of selenocystamine, add 5mL of tetrahydrofuran, stir evenly, place in a 50mm*50mm*2mm polytetrafluoroethylene film, and wait for the solvent to evaporate to dryness. Set for 12h to obtain diselenium bond exchange-dynamic epoxy network, denoted as P1-2;

[0050] The reaction process is as follows:

[0051]

[0052] (2) The schematic flow chart of preparing P1 by hot pressing P1-1 and P1-2 prepared in step (1) is as follows figure 1 Shown: Cut 0.5...

Embodiment 2

[0056] The present embodiment provides a kind of epoxy thermosetting resin, and its preparation method comprises the following steps:

[0057] (1) Mix 4mmol of poly(ethylene glycol) diglycidyl ether and 2mmol of 2,2'-dithiodianiline, add 6mL of dichloromethane, stir well and place in a 50mm*50mm*2mm polytetrafluoroethylene In the film tool, after the solvent evaporates, let it stand at 120°C for 10 hours to obtain a disulfide bond exchange-dynamic epoxy network, which is denoted as P2-1;

[0058] Mix 4mmol of bisphenol F diglycidyl ether and 2mmol of bis(2-aminophenyl) diselenide, add 6mL of dichloromethane, stir evenly, place in a 50mm*50mm*2mm polytetrafluoroethylene film, wait for the solvent After evaporating to dryness, let it stand at 120°C for 10 hours to obtain a diselenide bond exchange-dynamic epoxy network, denoted as P2-2;

[0059] The reaction process is as follows:

[0060]

[0061] (2) Shred 0.5g of P2-1 and 0.5g of P2-2, mix them, and heat-press for 16 hou...

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Abstract

The invention belongs to the technical field of polymer resin, and discloses epoxy thermosetting resin and a preparation method thereof. According to the preparation method, two different dynamic covalent bonds, namely S-S-and Se-Se-, are introduced into epoxy resin with different structures to prepare epoxy resin containing different structures and different cross-linking agents, and the-S-Se-cross-linked epoxy thermosetting resin composition is formed through high-temperature solid-phase fusion. The preparation method disclosed by the invention is simple, and the prepared epoxy thermosetting resin composition containing different structures has the same mechanical property as cross-linked epoxy resin with a single structure, so that not only is the mixing of the thermosetting epoxy resin with different structures realized, but also the composition has the functions of self-repairing, shape memory and the like.

Description

technical field [0001] The invention relates to the technical field of polymer resins, in particular to an epoxy thermosetting resin and a preparation method thereof. Background technique [0002] Epoxy resin is a common type of cross-linked resin, and is often directly referred to as a thermosetting material. Because of its high crosslinking density, good chemical resistance, high mechanical strength and good bonding performance, it is widely used in aerospace, ship transportation, machinery manufacturing, adhesives and other fields. But it is precisely because of its stable cross-linked network that it is difficult for thermosetting resins to melt and mix like thermoplastic resins, and it is also difficult to reprocess and reuse after damage. [0003] In response to the above problems, scientists have introduced dynamic covalent bonds into resins. The common method is to introduce dynamic covalent bonds, such as Diels-Alder reaction-dynamic epoxy network, imine-dynamic ep...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08G59/50C08J3/24
CPCY02W30/62
Inventor 邓煜东闫磊
Owner 江苏富琪森新材料有限公司
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