Device and method for sputtering and depositing metal on surface of magnetic powder material

A magnetic powder, sputtering deposition technology, applied in the direction of sputtering coating, metal processing equipment, metal material coating technology, etc., can solve the problem that it is difficult to realize the metal deposition of magnetic powder materials, and the surface deposition of magnetic powder materials cannot be realized height uniformity etc.

Active Publication Date: 2022-04-12
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI +1
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Problems solved by technology

Both of the above two patents achieve the uniformity of the surface deposition of the metal material by setting the vibrating parts in the deposition device and vibrating the magnetic powder material during deposition, but still can...

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  • Device and method for sputtering and depositing metal on surface of magnetic powder material
  • Device and method for sputtering and depositing metal on surface of magnetic powder material
  • Device and method for sputtering and depositing metal on surface of magnetic powder material

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Embodiment 1

[0098] This embodiment provides a device for depositing metal by sputtering on the surface of a magnetic powder material, which includes a cylindrical vacuum chamber 1, and the size of the vacuum chamber 1 is The vacuum chamber 1 is provided with a first vacuum chamber door and a second vacuum chamber door. The first vacuum chamber door 3 and the second vacuum chamber door correspond to the two open ends of the sample drum 2. The first vacuum chamber door 3 and the second vacuum chamber door are clam-style side-opening doors; including vacuum pump group 4, vacuum pump group 4 uses FF250-2000 molecular pump + 18L / min mechanical pump, which meets the requirements of 40min to vacuum 2×10 -3 Pa; including a magnetron sputtering target 5, the magnetron sputtering target 5 goes deep into the sample cylinder 2, and the magnetron sputtering target 5 is arranged on the inner wall of the first vacuum chamber door 3 of the vacuum chamber , the magnetron sputtering target 5 has a built-i...

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Abstract

The invention relates to the technical field of vacuum surface coating, in particular to a device and method for sputtering and depositing metal on the surface of a magnetic powder material. The device comprises a vacuum cavity, a vacuum pump set, a magnetron sputtering target, a cathode ion source, a water-cooled anode and a sample containing component arranged in the vacuum cavity, the sample containing component is a sample roller, the axis of the sample roller is arranged in the horizontal direction, and the sample roller can rotate around the axis of the sample roller; the two ends of the sample roller are opened, and the power device can drive the sample roller to rotate; the cathode ion source and the magnetron sputtering target inwards extend into the sample roller from the opening at the same end of the sample roller; and the water-cooling anode inwards extends into the sample roller from the opening at the other end of the sample roller. The device provided by the invention can realize high-speed uniform deposition on the surface of the magnetic powder material, improves the treatment efficiency, and is suitable for industrial production.

Description

technical field [0001] The invention relates to the technical field of vacuum surface coating, in particular to a device and method for sputtering and depositing metal on the surface of a magnetic powder material. Background technique [0002] Magnetic powder materials are usually uniformly doped with metal atoms within the crystal and grain boundaries to improve their coercive force stability under special conditions such as high temperature. [0003] At present, the process of uniformly doping metal into the interior of the magnetic magnetic circuit crystal and the grain boundary is mainly to mix the magnetic material powder and the doped powder and ball mill, and then diffuse to the interior of the crystal after high temperature tempering to form a uniformly doped magnetic material. . However, the doped metal particles used in this method are tens to hundreds of nanometers, and it is difficult to obtain uniformly doped magnetic materials during powder mixing and heat tre...

Claims

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Application Information

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IPC IPC(8): C23C14/35B22F1/17B22F1/18C23C14/16C23C14/18C23C14/50H01F41/02
CPCH01J37/3417H01J37/32816H01J37/32715H01J37/32055H01J37/3405C23C14/35C23C14/3485C23C14/3442H01J2237/182H01J2237/20214H01J2237/335
Inventor 张斌夏宁高凯雄张俊彦常忠亮鲍永平贾海军
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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