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Acid etching solution for high-precision circuit board

An acid etching solution and circuit board technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of high-precision circuit board etching accuracy, etc. Accuracy, reduction of etching side reactions, reduction of corrosion and wear effects

Pending Publication Date: 2022-03-01
长沙利洁环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The existing acid etching solution in the PCB industry can control the etching factor at about 3.0, which can only basically meet the etching standard of ordinary circuits, and it is difficult to meet the etching accuracy requirements for high-precision circuit boards; the acid value of HCl in the acid etching solution is also generally low. High, not only will have a greater impact on the etching factor, but will also cause greater corrosion and loss to the etching equipment; some side reactions of etching will produce a large amount of chlorine gas, seriously pollute the air, and there are certain safety hazards

Method used

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  • Acid etching solution for high-precision circuit board

Examples

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Effect test

Embodiment 1

[0028] A high-precision circuit board acid etching solution, its components are: copper ion concentration 120g / L, hydrochloric acid 1.0mol / L, nitric acid 1.0mol / L, ammonium chloride 160g / L, complexing agent citric acid 0.5g / L L, accelerator potassium chloride 0.8g / L, surfactant sodium dodecylbenzene sulfonate 0.004g / L, bank protection agent benzotriazole 0.008g / L, and the rest is water.

[0029] The working temperature of the high-precision circuit board etching solution in this embodiment is 50°C.

[0030] The high-precision circuit board acid etching solution used in this embodiment can control the acid value at 2.0N, which is much lower than that of the prior art. At the same time, the bank revetment agent is introduced to make the etching factor reach 3.5, which effectively improves the precision of the etched circuit pattern; through Add complexing agent, accelerator to replace NaClO 3 Such strong oxidants control the generation of chlorine gas and increase the etching r...

Embodiment 2

[0032] A high-precision circuit board acid etching solution, its components are: copper ion concentration 120g / L, hydrochloric acid 0.9mol / L, nitric acid 0.9mol / L, ammonium chloride 150g / L, complexing agent triammonium citrate 0.8 g / L, accelerator potassium nitrate 1.0g / L, surfactant sodium α-olefin sulfonate 0.006g / L, bank protection agent benzimidazole 0.02g / L, and the rest is water.

[0033] The working temperature of the high-precision circuit board etching solution in this embodiment is 50°C.

[0034] The high-precision circuit board acid etchant used in this embodiment can control the acid value at 1.8N, which is much lower than that of the prior art, and the etching factor reaches 3.9, which effectively improves the precision of the etched circuit pattern; by adding a complexing agent , Accelerator to replace NaClO 3 Such strong oxidants control the generation of chlorine gas and increase the etching rate; introduce appropriate amount of HNO 3 Effectively guarantee th...

Embodiment 3

[0036] A kind of high precision circuit board acid etching solution, its each component is: copper ion concentration 120g / L, hydrochloric acid 0.8mol / L, nitric acid 0.8mol / L, ammonium chloride 160g / L, complexing agent sulfamic acid 1.2g / L, accelerator potassium nitrate 1.2g / L, surfactant OP-10 0.008g / L, bank revetment agent 2-mercaptobenzothiazole 0.04g / L, and the rest is water.

[0037] The working temperature of the environment-friendly precision circuit board etching solution in this embodiment is 50°C.

[0038] The environment-friendly precision circuit board acid etching solution used in this embodiment can control the acid value at 1.6N, which is much lower than that of the prior art, and the etching factor reaches 3.8, which effectively improves the precision of the etched circuit pattern; by adding a complexing agent , Accelerator to replace NaClO 3 Such strong oxidants control the generation of chlorine gas and increase the etching rate; introduce appropriate amount...

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Abstract

The invention provides an acid etching solution for a high-precision circuit board. The etching solution comprises the following components: 100-160g / L of copper chloride, 0.7-1mol / L of hydrochloric acid, 0.7-1mol / L of nitric acid, 100-160g / L of ammonium chloride, 0.2-1.5 g / L of a complexing agent, 0.4-2.0 g / L of an accelerant, 0.006-0.08 g / L of a surfactant, 0.004-0.06 g / L of a bank protection agent and the balance of water, wherein the concentration of copper chloride is calculated according to copper ions (including Cu < 1 + > and Cu < 2 + >); wherein the concentration of the hydrochloric acid is 36-38%. The acidic etching solution has the beneficial effects that the acidic etching solution still has high etching rate, high copper dissolving amount and high etching factor in a low-acid environment, and can completely meet the production requirements of high-precision circuit boards.

Description

technical field [0001] The invention relates to an acidic chemical mixed liquid used for etching copper in the production process of high-precision circuit boards, and belongs to the technical field of etching technology. Background technique [0002] As a supporting carrier for assembling electronic components, printed circuit board (PCB) has become an indispensable and important part of the electronic information industry. As electronic products are currently developing in the direction of high processing speed, high component density, and large storage capacity, this poses a higher challenge to the precision of printed circuit board fine lines. [0003] In the production process of high-precision circuit boards, the etching process is to spray the etching solution evenly onto the surface of the copper foil through the nozzle, and the Cu in the potion 2+ Oxidation-reduction reaction occurs with copper foil that is not protected by etching resist, and unnecessary copper is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/02H05K3/06
CPCC23F1/18C23F1/02H05K3/067
Inventor 聂国勇陈仁华彭君
Owner 长沙利洁环保科技有限公司
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