Leveling agent and preparation method thereof

A technology of leveling agent and wetting agent, which is applied in the field of leveling agent and its preparation, which can solve the problems of difficult preparation of fine lines, chipped shoulders at the corners of through holes, and rough appearance of the board surface, so as to achieve good appearance and control surface copper thickness , to promote the effect of deposition

Active Publication Date: 2022-02-08
深圳市励高表面处理材料有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] In the hole filling technology, when the reaction condensate of amines and glycidyl ether or the quaternary ammonium derivative of the condensate are used as a leveling agent, it has the advantages of good board surface appearance and basically no pores in blind hole filling, but copper filling The speed is slower and requires a thicker surface copper coating, generally 20-25 μm, which is not easy to prepare fine lines; and when the reactant of imidazole and other compounds and polyepoxides containing ether bonds is used as a leveling agent, it has the ability to fill blind holes. The advantages of fast copper speed and thin surface copper. Generally, the surface copper thickness is 12-15 microns. However, during the copper plating process, it is easy to cause holes to be filled and the appearance of the board to be rough. When co-plating through blind holes, the corners of the through holes are easy to The phenomenon of "shoulder reduction"

Method used

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  • Leveling agent and preparation method thereof
  • Leveling agent and preparation method thereof
  • Leveling agent and preparation method thereof

Examples

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preparation example 1

[0045] Preparation Example 1: Carboxylation modified nano-silica was prepared by the following method:

[0046] ①Weigh 20mL of absolute ethanol, 45mL of deionized water, and 5mL of ammonia water, mix them, and stir them magnetically for 20 minutes under the condition of 1000r / min to prepare a stirring solution; weigh 4mL of ethyl orthosilicate and disperse them in 20mL of absolute ethanol, Stir magnetically for 30 minutes under the condition of 1000r / min to prepare a stirring solution; the concentration of ammonia water is 25%;

[0047] ②Mix the stirring solution and the mixing solution, react in a constant temperature water bath at 40°C for 2 hours, then react in a constant temperature water bath at 35°C for 2 hours, and finally react in a constant temperature water bath at 30°C for 1 hour to prepare a silica microsphere sol. After alcohol washing and centrifugation, the silica microspheres were obtained.

[0048] ③After mixing 5mL of silica microspheres, 2mL of deionized wa...

preparation example 2

[0051] Preparation example 2: Nanoscale alumina fibers are prepared by the following method:

[0052] ⅠWeigh 2.7g of aluminum powder, 18.25g of aluminum trichloride hexahydrate, and 100g of deionized water. After mixing, stir magnetically for 15 minutes under the condition of 1000r / min, and then reflux at a constant temperature of 90°C until the aluminum powder is completely reacted. At the end of the reflux, a transparent solution was obtained; the transparent solution was magnetically stirred at a constant temperature of 80°C for 5 hours to obtain a sol, cooled to room temperature, and left to age for 1 hour to obtain a spinnable sol;

[0053] ⅡA glass rod with a diameter of 6mm is inserted into the spinnable sol, and the glass rod is drawn out at a speed of 1m / s to obtain a fiber filament;

[0054] Ⅲ Put the cellulose in a desiccator to dry at room temperature for 12 hours, then place the dried fiber filaments in a tube furnace, raise the temperature from room temperature t...

preparation example 3

[0057] Preparation example 3: Hydroxylated nano boron nitride is prepared by the following method:

[0058] Weigh 200g of dicyandiamide and place it in a crucible, then place the crucible in a muffle furnace and conduct a thermal polycondensation reaction at 500°C for 4 hours with a heating rate of 3°C / min. After the reaction, g-C 3 N 4 ; Weigh g-C 3 N 4 3g and 0.9g of boric acid were mixed, added to 100mL of water, and ultrasonically dispersed at 20kHz for 30min to obtain a mixture; the mixture was stirred at a temperature of 100°C and a stirring speed of 800r / min until the water was evaporated to dryness to obtain g-C 3 N 4 / boronic acid precursor; the g-C 3 N 4 The boric acid precursor is placed in a quartz boat, and under the protection of nitrogen flow, it is heated to 800°C in a tube furnace at a rate of 3.3°C / min and calcined for 1 hour. After the reaction is completed, it is naturally cooled to room temperature to obtain a particle size Hydroxylated nano-boron n...

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Abstract

The invention relates to the field of circuit boards, and particularly discloses a leveling agent and a preparation method thereof. The leveling agent is prepared from the following raw materials in parts by weight: 15-30 parts of a nitrogen heterocyclic polymer, 75-100 parts of water, 1-2.5 parts of a preservative and 3-10 parts of a wetting agent; and the nitrogen-containing heterocyclic ring polymer is selected from one or more of poly 1-hydroxyl 2 (1-pyridyl) butyl acetate, poly 1-hydroxyl 4 (4 (6-methyl) pyridyl) 4 amino amyl acetate, poly 3-carbonyl 4 (1-pyridyl) amyl ether and poly 1, 2-dihydroxyl (4 (2-hydroxyl) pyridyl) 5 amino hexyl acetate. The preparation method comprises the following steps: weighing the nitrogen-containing heterocyclic ring polymer and water, mixing and stirring to prepare a mixed solution; and weighing the preservative and the wetting agent, adding the preservative and the wetting agent into the mixed solution, and stirring to obtain the finished product leveling agent. And meanwhile, the method has the advantages that the copper filling speed is high, the surface copper thickness is low, filling is basically free of gaps, the appearance state is good, and through-blind co-plating can be performed.

Description

technical field [0001] The application relates to the field of circuit boards, more specifically, it relates to a leveling agent and a preparation method thereof. Background technique [0002] Electroplating copper has important applications in the electronics industry, especially in the manufacture of printed circuit boards and semiconductors; there are wirings on each layer of the printed circuit board multilayer board, and the circuit connection between layers is through metallization holes; the existing metallization of holes is achieved by copper plating. In the electroplating process, due to the limitation of electric field distribution, the current density in the holes tends to be unevenly distributed, so that the current density in the holes is large, and the holes in the holes , Especially the current density in the middle of the hole is small, which easily causes the thickness of the copper coating at the hole to be much larger than the thickness of the coating in ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/00H05K3/42
CPCC25D3/38C25D7/00H05K3/424
Inventor 蔡辉高刘旭蔡辉星
Owner 深圳市励高表面处理材料有限公司
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