Pure adhesive film with core-shell structure and preparation method thereof

Abstract

The invention relates to the technical field of flexible circuit boards, and particularly discloses a pure adhesive film with a core-shell structure and a preparation method thereof. The preparation method of the polyacrylate pure adhesive film with the core-shell structure comprises the steps: pre-emulsifying to prepare a core-phase pre-emulsion and a shell-phase pre-emulsion, then adding a cross-linking agent, polymerizing to prepare a polymerized emulsion with the core-shell structure, and then adding a curing agent, an inorganic filler and the like to prepare an adhesive; and finally coating a first release film with the adhesive, carrying out thermocompression bonding on the first release film and a second release film, and rolling to obtain the pure adhesive film with the core-shell structure. The prepared pure adhesive film with the core-shell structure has the advantages of high heat-resistant stability and high peel strength, is free of performance defects, is suitable for market popularization and use, and meets market requirements.

Description

technical field [0001] The present application relates to the technical field of flexible circuit boards, in particular to a pure rubber film with a core-shell structure and a preparation method. Background technique [0002] Pure adhesive film is mainly used in flexible circuit boards (also known as FPC boards) to bond reinforcement boards and multi-layer boards. Pure rubber films are divided into high-viscosity and low-viscosity according to their initial viscosity. Adhesive pure film is mainly used in the bonding of multi-layer boards. [0003] In recent years, with the rapid development of the electronics industry, the use of FPC boards has increased significantly, and the use of pure plastic films applied to circuit boards has also increased rapidly. In addition, due to the development of electronic products in the direction of thinner and thinner, and applied in some harsh or extreme environments, the performance of the circuit board is required to be higher, and the...

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Problems solved by technology

[0004] In actual use, the existing pure rubber film in the market can no longer fully meet the actual needs. Due to the simple production process of the current pure rubber film, the structure of the produced pure rubber film is simple, which leads to the existence of the current pure rubber film. High-viscosity, poor heat resistance, low-viscosity and low peel strength, etc., cannot balance the initial tack, heat resistance and peel strength of the pure rubber film.

[0005] In view of the related technologies mentioned above, the inventor believes that the pure rubber film of the related technologies has defects such as poor heat resistance and low peel strength.

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