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A kind of solar silicon chip diamond wire cutting fluid, its preparation method and application

A technology for cutting solar silicon wafers and diamond wires, which is used in lubricating compositions, petroleum industry, etc., can solve problems such as the inability to meet the needs of large-scale silicon wafer cutting, and achieves reduction of sewage treatment costs, good permeability and film-forming properties, The effect of reducing the amount of pure water used

Active Publication Date: 2022-06-17
大连奥首科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to propose a solar silicon wafer diamond wire cutting fluid for the problem that the traditional diamond wire cutting fluid cannot meet the needs of cutting large-sized silicon wafers. The joint effect and the compounding of lubricants can effectively remove the silicon powder in the cutting gap during the cutting process of large-size silicon wafers of 182-210mm, improve cutting efficiency, reduce cutting abnormality rate and contamination rate, and can be used in diamond wire cutting of solar silicon wafers The technical field has good industrial application prospects and promotion potential

Method used

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  • A kind of solar silicon chip diamond wire cutting fluid, its preparation method and application
  • A kind of solar silicon chip diamond wire cutting fluid, its preparation method and application
  • A kind of solar silicon chip diamond wire cutting fluid, its preparation method and application

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Embodiment 1-10 and comparative example 1-3

[0034] The components of the diamond wire cutting fluid prepared in Examples 1-10 and Comparative Examples 1-3 and their mass parts are shown in Table 1.

[0035] Table 1 Examples 1-10 and Comparative Examples 1-3

[0036]

[0037]

[0038] Note: The chemical formula of wetting agent and penetrant are RO(CH 2 CH 2 O) x H, R is C 10 H 21 , the chemical formula of the lubricant is HO(C 3 H 6 O) a (CH 2 CH 2 O) b H.

[0039] The preparation method of the diamond wire cutting liquid of embodiment 1-10 is as follows:

[0040] S1: In a room temperature environment, pure water is added to the reactor after cleaning with pure water and stirring is started;

[0041] S2: Add wetting agent, penetrating agent, lubricant, sodium-containing compound in sequence and keep stirring;

[0042] S3: The temperature of the reactor is controlled and stirred at 35°C for 3 hours until it is completely dissolved;

[0043] S4: stop stirring and let stand for 6-12 hours;

[0044] S5: A...

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Abstract

The invention provides a solar silicon chip diamond wire cutting fluid, its preparation method and application. The solar silicon chip diamond wire cutting liquid of the present invention comprises the following components by mass: 10-30 parts of wetting agent; 15-35 parts of penetrating agent; 20-50 parts of lubricant; 10-20 parts of sodium-containing compound; 40‑60 parts of water. The invention also discloses a preparation method of the solar silicon chip diamond wire cutting fluid. The diamond wire cutting fluid of the present invention can effectively remove the silicon powder in the cutting gap during the cutting process of large-size solar silicon wafers of 182-210 mm through the joint action of specific components of wetting agent and penetrating agent, and the compounding of lubricants, and improve the cutting efficiency. Efficiency, cutting abnormality rate and contamination rate are reduced, and it has good industrial application prospect and promotion potential in the field of solar silicon wafer diamond wire cutting technology.

Description

technical field [0001] The invention relates to metal cutting fluid technology, in particular to a solar silicon wafer diamond wire cutting fluid, a preparation method and application thereof. Background technique [0002] With the continuous development and maturity of solar photovoltaic industry technology, the demand for silicon wafers has grown rapidly. Slicing is the first process of deep processing of silicon wafers, and silicon wafers account for 30-40% of the cost of solar photovoltaic modules, so the improvement of silicon wafer technology is of great significance to reduce module costs. In recent years, the size of silicon wafers has been continuously optimized, and silicon wafers of 158.75mm, 160mm+, 182mm, 210mm and other sizes have appeared. The enlargement and thinning of photovoltaic silicon wafers have become the main technical direction of major manufacturers. This not only can Effectively reduce costs and maximize component efficiency. [0003] 182mm and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M173/02C10N30/04C10N30/18
CPCC10M173/02C10M2209/104C10M2209/105C10M2209/12C10M2221/02C10M2209/084C10N2030/04C10N2030/64C10N2030/18
Inventor 侯军李传友
Owner 大连奥首科技有限公司
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